Method of manufacturing an electronic component
First Claim
1. A method of manufacturing an electronic component, comprising:
- providing a wire having first and second ends and a pre-formed core;
winding the wire about at least a portion of the pre-formed core and connecting the first and second wire ends to at least one terminal for mounting the electronic component to a circuit; and
heating a mixture of magnetic and non-magnetic material to a liquid and dispersing the liquefied mixture over at least a portion of the wire and pre-formed core using an injection molding or compression molding process, and hardening the mixture without exposing the wire and pre-formed core to the damaging forces of a dry press process to form the electronic component with a generally planar top surface with which the component can be picked and placed on the circuit using conventional pick-and-place equipment.
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Accused Products
Abstract
A method of manufacturing an electronic component including providing a wire having first and second ends and a pre-formed core, winding the wire about at least a portion of the pre-formed core and connecting the first and second wire ends to at least one terminal for mounting the component to a circuit, and using a wet press process to form a mixture of magnetic and/or non-magnetic material over at least a portion of the wire and pre-formed core, and harden the mixture without exposing the wire and pre-formed core to the damaging forces of a dry press process to form an electronic component with a generally planar top surface with which the component can be picked and placed on a circuit using conventional pick-and-place equipment.
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Citations
44 Claims
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1. A method of manufacturing an electronic component, comprising:
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providing a wire having first and second ends and a pre-formed core; winding the wire about at least a portion of the pre-formed core and connecting the first and second wire ends to at least one terminal for mounting the electronic component to a circuit; and heating a mixture of magnetic and non-magnetic material to a liquid and dispersing the liquefied mixture over at least a portion of the wire and pre-formed core using an injection molding or compression molding process, and hardening the mixture without exposing the wire and pre-formed core to the damaging forces of a dry press process to form the electronic component with a generally planar top surface with which the component can be picked and placed on the circuit using conventional pick-and-place equipment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of manufacturing an electronic component, comprising:
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providing a wire having first and second ends, a core having first and second ends with a portion extending therebetween about which the wire is wound, and at least one terminal for connecting to the wire; winding the wire onto the portion extending between the first and second ends of the core and connecting the wire to the at least one terminal; heating a powdered mixture of magnetic and non-magnetic materials to create a liquefied mixture; dispersing the liquefied mixture over at least a portion of the wound wire in a mold using an injection molding or compression molding process without exposing the wire to the damaging forces of a dry press process; hardening the heated mixture over the at least a portion of the wire to form an outer body of the electronic component in the mold; and
removing the hardened electronic component from the mold without requiring further baking of the electronic component to provide a finished electronic component. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of manufacturing an electronic component, comprising:
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providing a wire having first and second ends; winding the wire into a coil having a central opening orientated about a generally vertical axis with the first and second wire ends connected to or forming terminals for mounting the component to a circuit; heating a mixture of magnetic and non-magnetic material to a liquid and dispersing the liquefied mixture over the coil, and hardening the mixture without exposing the coil to the damaging forces of a dry press process to form an electronic component with a generally planar top surface with which the component can be picked and placed on a circuit using conventional pick-and-place equipment, wherein the mixture comprises at least about 80% iron. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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Specification