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Method of manufacturing an electronic component

  • US 9,318,251 B2
  • Filed: 09/17/2010
  • Issued: 04/19/2016
  • Est. Priority Date: 08/09/2006
  • Status: Active Grant
First Claim
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1. A method of manufacturing an electronic component, comprising:

  • providing a wire having first and second ends and a pre-formed core;

    winding the wire about at least a portion of the pre-formed core and connecting the first and second wire ends to at least one terminal for mounting the electronic component to a circuit; and

    heating a mixture of magnetic and non-magnetic material to a liquid and dispersing the liquefied mixture over at least a portion of the wire and pre-formed core using an injection molding or compression molding process, and hardening the mixture without exposing the wire and pre-formed core to the damaging forces of a dry press process to form the electronic component with a generally planar top surface with which the component can be picked and placed on the circuit using conventional pick-and-place equipment.

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