Systems and methods for preparation of samples for sub-surface defect review
First Claim
1. A method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus, the method comprising:
- obtaining a first results file from an inspection apparatus, wherein the first results file includes locations of defects detected in a device being manufactured by the inspection apparatus;
re-detecting a defect at a location indicated in the first results file;
marking on the substrate the location of the defect with multiple discrete and separate marking points, each said marking point having predetermined positioning relative to the location of the defect that is given by a number of pixels and a predetermined direction;
receiving a design file with a design for the device;
determining the location of the defect relative to the design for the device;
ascertaining a cut location and a cut angle in an at least a partly-automated manner using the design for the device; and
revising the first results file to generate a second results file which includes the cut location and the cut angle.
1 Assignment
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Accused Products
Abstract
One embodiment relates to a method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus. A defect at a location indicated in a first results file is re-detected, and the location of the defect is marked with at least one discrete marking point having predetermined positioning relative to the location of the defect. The location of the defect may be determined relative to the design for the device, and a cut location and a cut angle may be determined in at least a partly-automated manner using that information. Another embodiment relates to a system for preparing a sample for sub-surface review. Another embodiment relates to a method for marking a defect for review on a target substrate. Other embodiments, aspects and feature are also disclosed.
43 Citations
20 Claims
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1. A method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus, the method comprising:
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obtaining a first results file from an inspection apparatus, wherein the first results file includes locations of defects detected in a device being manufactured by the inspection apparatus; re-detecting a defect at a location indicated in the first results file; marking on the substrate the location of the defect with multiple discrete and separate marking points, each said marking point having predetermined positioning relative to the location of the defect that is given by a number of pixels and a predetermined direction; receiving a design file with a design for the device; determining the location of the defect relative to the design for the device; ascertaining a cut location and a cut angle in an at least a partly-automated manner using the design for the device; and revising the first results file to generate a second results file which includes the cut location and the cut angle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A system for preparing a sample for sub-surface review, the system comprising:
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an inspection apparatus configured to inspect a device for defects, select defects for sub-surface review, and output data on the selected defects to a first results file; a scanning electron microscope apparatus configured to re-detect a defect at a location indicated in the first results file, mark on the sample the location of the defect with at least one distinct marking point with predetermined positioning relative to the location of the defect, receive a design file with a design for the device, ascertain a cut location and a cut angle in at least a partly-automated manner using the design for the device, and revise the first results file to generate a second results file which includes the cut location and the cut angle, wherein said at least one distinct marking point comprises a geometrical pattern which has alternating darker and lighter marking regions around a center location, each said marking region being a polygon having a vertex at the center location. - View Dependent Claims (13, 14, 15)
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16. A method for marking a defect for review on a target substrate, the method comprising:
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obtaining a first results file from an inspection apparatus, wherein the first results file includes locations of defects detected in the target substrate by the inspection apparatus, wherein the defects detected include the defect for review; re-detecting the defect for review at a location indicated in the first results file; and marking the location of the defect with a mark on the target substrate that comprises at least one distinct marking point with predetermined positioning and separation relative to the defect for review, wherein said at least one distinct marking point comprises a geometrical pattern which has alternating darker and lighter marking regions around a center location, each said marking region being a polygon having a vertex at the center location. - View Dependent Claims (17, 18, 19, 20)
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Specification