Device and method for determining the temperature of a heat sink
First Claim
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1. A device, comprising:
- a printed-circuit board;
a sensor; and
a heat sink;
wherein the sensor is connected to the heat sink in a heat-conducting manner;
wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner;
wherein the printed-circuit board is a multi-layer printed-circuit board;
wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at the surface of the printed-circuit board facing the heat sink; and
wherein the metallic areas are printed-circuit traces of the printed-circuit board.
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Abstract
A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.
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Citations
21 Claims
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1. A device, comprising:
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a printed-circuit board; a sensor; and a heat sink; wherein the sensor is connected to the heat sink in a heat-conducting manner; wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner; wherein the printed-circuit board is a multi-layer printed-circuit board; wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at the surface of the printed-circuit board facing the heat sink; and wherein the metallic areas are printed-circuit traces of the printed-circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14)
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10. A device, comprising:
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a printed-circuit board; a sensor having a connection to the printed-circuit board via connecting points; and a heat sink; wherein the sensor is connected to the heat sink in a heat-conducting manner; wherein the printed-circuit board is connected to the heat sink; wherein the printed-circuit board is a multi-layer printed-circuit board; wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at a surface of the printed-circuit board facing the heat sink; and wherein the printed-circuit board and the sensor are connected at least by a continuous material including an adhesive connection, the adhesive connection between the printed-circuit board and the sensor having a lower heat transfer resistance than the connection of the sensor to the printed-circuit board via the connecting points of the sensor.
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15. A method for determining a temperature of a heat source connected to a heat sink in a heat-conducting manner, a sensor being connected to the heat sink in a heat-conducting manner, a multi-layer printed-circuit board being equipped with the sensor, comprising:
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determining a temperature of the sensor; determining a measure for a temperature rise within a period of time; determining a correction factor associated with the temperature rise, the correction factor being based on at least one of (a) a slope value of a curve of the temperature of the sensor plotted against time, and (b) an environmental temperature value; and determining the temperature of the heat source from a sum of the temperature of the sensor and the measure for the temperature rise multiplied by the correction factor associated with the temperature rise. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification