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Device and method for determining the temperature of a heat sink

  • US 9,318,406 B2
  • Filed: 03/04/2006
  • Issued: 04/19/2016
  • Est. Priority Date: 03/22/2005
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a printed-circuit board;

    a sensor; and

    a heat sink;

    wherein the sensor is connected to the heat sink in a heat-conducting manner;

    wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner;

    wherein the printed-circuit board is a multi-layer printed-circuit board;

    wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at the surface of the printed-circuit board facing the heat sink; and

    wherein the metallic areas are printed-circuit traces of the printed-circuit board.

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