Method of fabricating semiconductor device having grooved source contact region
First Claim
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1. A method of fabricating a semiconductor device, comprising:
- forming a channel layer on a substrate;
forming trench patterns in the channel layer;
forming impurity bodies in the channel layer between the trench patterns;
forming grooves in the impurity bodies formed in the channel layer;
forming source isolation regions in the impurity bodies at bottom portions of the grooves; and
forming source regions in the impurity bodies at sidewall portions of the grooves,wherein the source isolation regions directly contact the source regions on either side of the sidewall portions of the grooves;
wherein the forming of the trench patterns comprises forming cell trench patterns, andthe forming of the cell trench patterns comprises;
forming cell trenches in the channel layer;
forming cell shield patterns in lower portions of the cell trenches;
forming cell gate patterns on the cell shield patterns positioned within the cell trenches; and
forming cell capping patterns on the cell gate patterns positioned within the cell trenches;
wherein the forming of the cell shield patterns comprises;
conformally forming a preliminary cell shield insulating layer on inner walls of the cell trenches;
forming a preliminary cell shield electrode on the preliminary cell shield insulating layer to fill the cell trenches;
recessing the preliminary cell shield electrode to form a cell shield electrode having a top surface disposed in the middle region of the cell trench; and
recessing the preliminary cell shield insulating layer to form a cell shield insulating layer to expose upper portions of the inner walls of the cell trenches and having a top surface disposed at a lower level than the top surface of the cell shield electrode;
wherein the forming of the cell gate patterns comprises;
forming a cell gate insulating layer on the top surface of the cell shield electrode and the inner walls of the cell trenches;
forming a preliminary cell gate electrode on the cell gate insulating layer to fill the cell trenches; and
recessing the preliminary cell gate electrode to form a cell gate electrode having a top surface disposed in the middle of the cell trench; and
wherein the forming of the cell capping pattern comprises;
forming a cell buffer layer on the top surface of the cell gate electrode;
forming a cell capping stopper layer on the cell buffer layer and the inner walls of the cell trenches;
forming a preliminary cell capping layer on the cell capping stopper layer to fill the cell trenches; and
planarizing the preliminary cell capping layer to a cell capping layer, so that the cell capping layer remains only within the cell trenches.
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Abstract
In a method of fabricating a semiconductor device, a channel layer is formed on a substrate, and trench patterns are formed in the channel layer. Impurity bodies are formed in the channel layer between the trench patterns, and grooves are formed between the trench patterns in the impurity bodies formed in the channel layer. Source isolation regions are formed in the impurity bodies at bottom portions of the grooves, and source regions are formed in the impurity bodies at sidewall portions of the grooves.
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Citations
20 Claims
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1. A method of fabricating a semiconductor device, comprising:
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forming a channel layer on a substrate; forming trench patterns in the channel layer; forming impurity bodies in the channel layer between the trench patterns; forming grooves in the impurity bodies formed in the channel layer; forming source isolation regions in the impurity bodies at bottom portions of the grooves; and forming source regions in the impurity bodies at sidewall portions of the grooves, wherein the source isolation regions directly contact the source regions on either side of the sidewall portions of the grooves; wherein the forming of the trench patterns comprises forming cell trench patterns, and the forming of the cell trench patterns comprises; forming cell trenches in the channel layer; forming cell shield patterns in lower portions of the cell trenches; forming cell gate patterns on the cell shield patterns positioned within the cell trenches; and forming cell capping patterns on the cell gate patterns positioned within the cell trenches; wherein the forming of the cell shield patterns comprises; conformally forming a preliminary cell shield insulating layer on inner walls of the cell trenches; forming a preliminary cell shield electrode on the preliminary cell shield insulating layer to fill the cell trenches; recessing the preliminary cell shield electrode to form a cell shield electrode having a top surface disposed in the middle region of the cell trench; and recessing the preliminary cell shield insulating layer to form a cell shield insulating layer to expose upper portions of the inner walls of the cell trenches and having a top surface disposed at a lower level than the top surface of the cell shield electrode; wherein the forming of the cell gate patterns comprises; forming a cell gate insulating layer on the top surface of the cell shield electrode and the inner walls of the cell trenches; forming a preliminary cell gate electrode on the cell gate insulating layer to fill the cell trenches; and recessing the preliminary cell gate electrode to form a cell gate electrode having a top surface disposed in the middle of the cell trench; and wherein the forming of the cell capping pattern comprises; forming a cell buffer layer on the top surface of the cell gate electrode; forming a cell capping stopper layer on the cell buffer layer and the inner walls of the cell trenches; forming a preliminary cell capping layer on the cell capping stopper layer to fill the cell trenches; and planarizing the preliminary cell capping layer to a cell capping layer, so that the cell capping layer remains only within the cell trenches. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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4. The method of claim 1, wherein:
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the cell capping stopper layer includes silicon nitride, the cell capping layer includes silicon oxide, and a top surface of the cell capping layer is co-planar with, or at a higher level than, the top surface of the channel layer.
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5. The method of claim 1, wherein each of the cell gate patterns has a greater horizontal width than each of the cell shield patterns.
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6. The method of claim 1, wherein sidewall portions of the grooves are inclined,
the forming of the source isolation regions comprises implanting P-type impurities along profiles of the bottom portions and sidewall portions of the grooves, and the forming of the source regions comprises obliquely implanting N-type impurities under the sidewall portions of the grooves to inverse the source isolation regions disposed under the sidewall portions of the grooves from a P type to an N type. -
7. The method of claim 1, further comprising:
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conformally forming a preliminary barrier metal on the bottom and sidewall portions of the grooves; forming a preliminary source electrode metal on the preliminary barrier metal to fill the grooves; and planarizing the preliminary source electrode metal.
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8. A method of fabricating a semiconductor device, comprising:
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forming a channel layer on a substrate; forming trench patterns in the channel layer; forming impurity bodies in the channel layer between the trench patterns; forming grooves in the impurity bodies formed in the channel layer; after forming the grooves, implanting impurities in the impurity bodies exposed by the grooves to form source isolation regions in the impurity bodies at bottom portions of the grooves; and after forming the source isolation regions, implanting impurities in the impurity bodies exposed by the grooves to form source regions in the impurity bodies at sidewall portions of the grooves. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification