×

High efficiency light emitting diode package suitable for wafer level packaging

  • US 9,318,671 B2
  • Filed: 04/18/2014
  • Issued: 04/19/2016
  • Est. Priority Date: 04/18/2014
  • Status: Active Grant
First Claim
Patent Images

1. A light emitting diode (LED) package comprising:

  • a carrier substrate having a predefined surface area;

    an LED device bonded to the carrier substrate, the LED device having a top surface, a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and a sidewall having a set back distance from a sidewall of the carrier substrate, wherein the set back distance is between one quarter of one percent and fifteen percent of a width of the carrier substrate; and

    an encapsulant lens formed over the LED device, the encapsulant lens having a top surface inclined inwardly toward the top surface of the LED device and having a thickness at an interior portion of at least ten percent of a thickness at a peripheral portion relative to the top surface of the LED device.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×