High efficiency light emitting diode package suitable for wafer level packaging
First Claim
1. A light emitting diode (LED) package comprising:
- a carrier substrate having a predefined surface area;
an LED device bonded to the carrier substrate, the LED device having a top surface, a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and a sidewall having a set back distance from a sidewall of the carrier substrate, wherein the set back distance is between one quarter of one percent and fifteen percent of a width of the carrier substrate; and
an encapsulant lens formed over the LED device, the encapsulant lens having a top surface inclined inwardly toward the top surface of the LED device and having a thickness at an interior portion of at least ten percent of a thickness at a peripheral portion relative to the top surface of the LED device.
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Accused Products
Abstract
An LED package and method for LED packaging is disclosed. In one embodiment, an LED package includes a carrier substrate having a predefined surface area, an LED device bonded to the carrier substrate, the LED device having a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and an encapsulant lens having a top surface inclined inwardly at an angle in the range of about 10° to about 140°. In one embodiment, the top surface of the encapsulant lens layer has a concave cone shape. In one embodiment, a wafer level packaging process includes forming an encapsulant lens layer portion having a top surface inclined inwardly at an angle in the range of about 10° to about 140° on each of a plurality of LED devices bonded to a carrier substrate wafer.
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Citations
32 Claims
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1. A light emitting diode (LED) package comprising:
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a carrier substrate having a predefined surface area; an LED device bonded to the carrier substrate, the LED device having a top surface, a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and a sidewall having a set back distance from a sidewall of the carrier substrate, wherein the set back distance is between one quarter of one percent and fifteen percent of a width of the carrier substrate; and an encapsulant lens formed over the LED device, the encapsulant lens having a top surface inclined inwardly toward the top surface of the LED device and having a thickness at an interior portion of at least ten percent of a thickness at a peripheral portion relative to the top surface of the LED device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A light emitting diode (LED) package comprising:
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a carrier substrate having a predefined surface area; an LED device bonded to the carrier substrate, the LED device having a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and a side wall having a set back distance from a side wall of the carrier substrate, wherein the set back distance is between one quarter of one percent and fifteen percent of a width of the carrier substrate; and an encapsulant lens formed over the LED device, the encapsulant lens having a top surface shaped in such a way that the LED package is capable of emitting at least 81 percent of light emitted by the LED device. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for packaging a light emitting diode (LED) device, comprising:
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forming an encapsulant lens layer on a carrier substrate wafer having a plurality of LED devices disposed thereon, the encapsulant lens layer including a plurality of portions, each portion disposed over one of the plurality of LED devices and each portion of the encapsulant lens layer having a top surface inclined inwardly toward the top surface of the LED device and having a thickness at an interior portion of at least ten percent of a thickness at a peripheral portion relative to the top surface of the LED device; and dicing the carrier substrate wafer into a plurality of LED packages such that each LED package includes an LED device with a footprint area of at least fifty percent of a surface area of a carrier substrate, and a side wall having a set back distance from a side wall of the carrier substrate, the set back distance being between one quarter of one percent and fifteen percent of a width of the carrier substrate. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
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Specification