DC-DC converter module and multi-layer substrate

• US 9,320,134 B2
• Filed: 03/11/2013
• Issued: 04/19/2016
• Est. Priority Date: 01/25/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Hiei, Tomoyoshi
• Primary Examiner(s): Fureman, Jared
• Assistant Examiner(s): Yeshaw, Esayas
• Application Number:
  US13/792,472
• Publication Number:
  US 20130187480A1
• Time in Patent Office: 1,135 Days
• Field of Search: 307/112, 361/782
• US Class Current: 1/1
• CPC Class Codes: H01F 37/005 without magnetic core
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H02M 1/44 Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
• CPC Class Codes: H02M 3/04 by static converters
• CPC Class Codes: H02M 3/158 including plural semiconductor devices as final control devices for a single load
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor

Abstract

A DC-DC converter module includes a multi-layer substrate, a switching IC, and a coil. The multi-layer substrate includes component mounting electrodes provided on the top surface and an input terminal, an output terminal, and ground terminals provided on the bottom surface. The switching IC switches an input voltage and includes an input electrode, an output electrode, and a ground electrode, and is mounted on the top surface of the substrate by connecting the electrodes to the component mounting electrodes. The coil is arranged within the multi-layer substrate in a spiral shape with an axis extending in the substrate stacking direction. The bottom surface side end of the coil is connected to the input/output electrode of the switching IC.

Claims

1. A DC-DC converter module comprising:

a multi-layer substrate including component mounting electrodes provided on a first surface thereof in a stacking direction and an input terminal, an output terminal, and a ground terminal provided on a second surface thereof in the stacking direction;

a switching IC that switches an input voltage and outputs a switched voltage and that includes an input electrode that is connected to the input terminal through at least one of the component mounting electrodes, an output electrode that is connected to the output terminal through at least one of the component mounting electrodes, and a ground electrode that is connected to the ground terminal through at least one of the component mounting electrodes; and

a coil that is arranged within the multi-layer substrate in a spiral shape with an axis extending in the stacking direction, an end of the coil nearer to the first surface being connected to the input terminal or the output terminal, and an end of the coil nearer to the second surface being connected to the input electrode or the output electrode of the switching IC and extending through an inside of the multi-layer substrate.

2. The DC-DC converter module according to claim 1, wherein a shield layer including a ground electrode and that is connected to the ground terminal is provided between the first surface and layers on which the coil is provided.

3. The DC-DC converter module according to claim 1, wherein the multi-layer substrate includes a magnetic layer.

4. The DC-DC converter module according to claim 1, further comprising:

a capacitor mounted on at least one of the component mounting electrodes;

wherein

a first end of the capacitor is connected to an end of the coil nearer to the first surface and a second end of the capacitor is connected to the ground terminal.

5. The DC-DC converter module according to claim 1, wherein

the multi-layer substrate includes a plurality of magnetic layers stacked on each other in the stacking direction.

6. The DC-DC converter module according to claim 5, wherein

the multi-layer substrate includes a plurality of dielectric layers stacked with the plurality of magnetic layers in the stacking direction.

7. The DC-DC converter module according to claim 1, wherein

the multi-layer substrate includes a plurality of dielectric layers stacked on each other in the stacking direction.

8. The DC-DC converter module according to claim 1, further comprising:

a capacitor defined by wiring patterns disposed within the multi-layer substrate;

wherein

a first end of the capacitor is connected to an end of the coil nearer to the first surface and a second end of the capacitor is connected to the ground terminal.

9. The DC-DC converter module according to claim 1, further comprising a plurality of coils or a plurality of capacitors provided in or on the multi-layer substrate.

10. The DC-DC converter module according to claim 1, further comprising a wiring line connected between the coil and the switching IC on the second surface side at which the ground terminal is located.

11. The DC-DC converter module according to claim 1, further comprising a shield layer located on the second surface of the multi-layer substrate.

12. The DC-DC converter module according to claim 1, wherein no shield layer is provided in the multi-layer substrate.

13. The DC-DC converter module according to claim 1, further comprising a capacitor located at a position spaced away from the multi-layer substrate.

14. The DC-DC converter module according to claim 1, further comprising:

a wiring line provided in the multi-layer substrate;

wherein

the wiring line extends downward in the stacking direction from the output electrode of the switching IC, passes through portions spaced away from the coil, and is connected to the second surface side end of the coil; and

the coil is not directly under the output electrode of the switching IC.

15. The DC-DC converter module according to claim 1, further comprising a capacitor located on a top surface of the multi-layer substrate and wiring lines arranged to connect the capacitor to the coil and the ground terminal.

16. A multi-layer substrate comprising:

a substrate body including a first surface and a second surface;

component mounting electrodes provided on the first surface of the substrate body;

an input electrode, an output electrode, and a ground electrode of a switching IC mounted on the component mounting electrodes;

an input terminal, an output terminal, and a ground terminal provided on the second surface of the substrate body;

a coil arranged within the substrate body in a spiral shape with an axis extending in a stacking direction;

wherein

an end of the coil nearer to the first surface is connected to the input terminal or the output terminal, an end of the coil nearer to the second surface is connected to the component mounting electrode to which the input electrode or the output electrode of the switching IC is connected, and the end of the coil nearer the second surface extends through an inside of the substrate body.

17. The multi-layer substrate according to claim 16, wherein the substrate body includes a plurality of magnetic layers stacked on each other in the stacking direction.

18. The multi-layer substrate according to claim 17, wherein the substrate body includes a plurality of dielectric layers stacked with the plurality of magnetic layers in the stacking direction.

19. The multi-layer substrate according to claim 16, wherein the substrate body includes a plurality of dielectric layers stacked on each other in the stacking direction.