Electric discharge protection for surface mounted and embedded components
First Claim
Patent Images
1. A printed circuit board, comprising:
- at least one conductor;
a voltage switchable dielectric material (VSDM) layer applied to the at least one conductor;
an electronic component having at least one lead and disposed on the VSDM layer, wherein the at least one lead is electrically coupled to the VSDM layer;
a via; and
a conductive pad connected to the conductor by the via,wherein the VSDM layer comprises an active volume defined by a gap between the at least one lead and the conductive pad, wherein the active volume to pass current through to a ground during an overvoltage event.
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Abstract
Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.
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Citations
14 Claims
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1. A printed circuit board, comprising:
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at least one conductor; a voltage switchable dielectric material (VSDM) layer applied to the at least one conductor; an electronic component having at least one lead and disposed on the VSDM layer, wherein the at least one lead is electrically coupled to the VSDM layer; a via; and a conductive pad connected to the conductor by the via, wherein the VSDM layer comprises an active volume defined by a gap between the at least one lead and the conductive pad, wherein the active volume to pass current through to a ground during an overvoltage event. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A printed circuit board, comprising:
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at least one non-conductive layer; at least one conductor; a voltage switchable dielectric material (VSDM) layer applied to one of the at least one non-conductive layer; an electronic component having at least one lead and is mounted to the VSDM layer, wherein the at least one lead is electrically coupled to the VSDM layer; and a via; and a conductive pad connected to the conductor by the via, wherein the VSDM layer comprises an active volume defined by a gap between the at least one lead and the conductive pad, wherein the active volume to pass current through to a ground during an overvoltage event. - View Dependent Claims (9, 10, 11, 13, 14)
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12. The printed circuit board of 8, wherein the VSDM layer is incorporated within the at least one non-conductive layer.
Specification