Clay-like composition for forming sintered copper body, powder for clay-like composition for forming sintered copper body, method of manufacturing clay-like composition for forming sintered copper body, sintered copper body, and method of manufacturing sintered copper body

• US 9,321,105 B2
• Filed: 11/17/2011
• Issued: 04/26/2016
• Est. Priority Date: 11/18/2010
• Status: Active Grant

• Current Assignee: Mitsubishi Materials Corporation
• Original Assignee: Mitsubishi Materials Corporation
• Inventors: Yamaji, Takashi, Ido, Yasuo, Yamamoto, Yoshifumi, Otani, Shinji
• Primary Examiner(s): Roe, Jessee
• Assistant Examiner(s): Mai, Ngoclan T
• Application Number:
  US13/298,515
• Publication Number:
  US 20120128523A1
• Time in Patent Office: 1,622 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B22F 2201/01 Reducing atmosphere
• CPC Class Codes: B22F 2999/00 Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 3/1007 Atmosphere B22F3/1021 takes precedence
• CPC Class Codes: C22C 32/0021 Matrix based on noble metals, Cu or alloys thereof

Abstract

A clay-like composition for forming a sintered copper body of the present invention includes a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper; a binder; and water, wherein the amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %.

Claims

1. A composition for forming a sintered copper body comprising:

a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper;

a binder; and

water,

wherein an amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %,

an amount of Fe in the powder constituent is 1000 ppm or less,

wherein an average particle diameter of the copper-containing oxide powder is from 3 μ

m to 10 μ

m, and

wherein an average particle diameter of the copper-containing metal powder is from 3 μ

m to 10 μ

m.

2. The composition for forming a sintered copper body according to claim 1,

wherein CuO powder is used as the copper-containing oxide powder, and the amount of the CuO powder in the powder constituent is in a range of from 20 mass % to 40 mass %.

3. The composition for forming a sintered copper body according to claim 1,

wherein Cu₂O powder is used as the copper-containing oxide powder, and the amount of the Cu₂O powder in the powder constituent is in a range of from 36 mass % to 71 mass %.

4. The composition for forming a sintered copper body according to claim 1, wherein a mixing ratio (mass ratio) B/A between the powder constituent (A) and the binder and water (B) is in a range of 2/10≦

B/A≦

3/10.

5. The composition for forming a sintered copper body according to claim 1, wherein the average particle diameter of the copper-containing oxide powder is from 5 μ

m to 10 μ

m.

6. The composition for forming a sintered copper body according to claim 1, wherein the average particle diameter of the copper-containing metal powder is from 5 μ

m to 10 μ

m.

7. The composition for forming a sintered copper body according to claim 1, further comprising at least any one of fatty substance and a surface active agent.

8. The composition for forming a sintered copper body according to claim 1,

wherein the binder is at least 1 or 2 or more kinds of binder(s) selected from a group consisting of a cellulose-based binder, a polyvinyl compound-based binder, an acryl compound-based binder, a wax-based binder, a resin-based binder, starch, gelatin, and flour.

9. The composition for forming a sintered copper body according to claim 1, wherein CuO powder is used as the copper-containing oxide powder, and the average particle diameter of the CuO powder is from 3 μ

m to 10 μ

m, and

Cu powder is used as the copper-containing metal powder, and the average particle diameter of the Cu powder is from 3 μ

m to 10 μ

m.

10. A sintered copper body which is obtained by baking the composition for forming a sintered copper body according to claim 1.

17. A method of manufacturing a sintered copper body comprising,

making the composition for forming a sintered copper body according to claim 1 into an arbitrary shape to obtain an object, and

drying the object and then baking the object in a reduction atmosphere or a non-oxidizing atmosphere, thereby obtaining a sintered copper body.

18. The method of manufacturing a sintered copper body according to claim 17, wherein the drying and baking steps are performed at a temperature in a range of from 800°

C. to 1000°

C. for 30 minutes to 180 minutes.

19. The method of manufacturing a sintered copper body according to claim 17, wherein the object is baked while being buried in activated carbon.

11. A powder for a composition for forming a sintered copper body comprising:

a copper-containing metal powder which contains copper; and

a copper-containing oxide powder which contains copper,

wherein the oxygen amount in the powder for the clay-like composition is in a range of from 4 mass % to 8 mass %,

an amount of Fe in the powder for the clay-like composition is 1000 ppm or less,

wherein an average particle diameter of the copper-containing oxide powder is from 3 μ

m to 10 μ

m, and

wherein an average particle diameter of the copper-containing metal powder is from 3 μ

m to 10 μ

m.

12. The powder for a composition for forming a sintered copper body according to claim 11,

wherein CuO powder is used as the copper-containing oxide powder, and the amount of the CuO powder is in a range of from 20 mass % to 40 mass %.

13. The powder for a composition for forming a sintered copper body according to claim 11,

wherein Cu₂O powder is used as the copper-containing oxide powder, and the amount of the Cu₂O powder is in a range of from 36 mass % to 71 mass %.

14. The powder for a composition for forming a sintered copper body according to claim 11,

wherein the average particle diameter of the copper-containing oxide powder is from 5 μ

m to 10 μ

m.

15. The powder for a composition for forming a sintered copper body according to claim 11,

wherein the average particle diameter of the copper-containing metal powder is from 5 μ

m to 10 μ

m.

16. A method of manufacturing a composition for forming a sintered copper body comprising

mixing together a copper-containing metal powder which contains copper, a copper-containing oxide powder which contains copper, a binder, and water in a stainless steel kneading container having an inner wall coated with CrN, wherein,

an amount of oxygen contained in a powder constituent containing the copper-containing metal powder and the copper-containing oxide powder is in a range of from 4 mass % to 8 mass %, and

an amount of Fe in the powder constituent is 1000 ppm or less.