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Laser-based material processing apparatus and methods

  • US 9,321,126 B2
  • Filed: 03/01/2011
  • Issued: 04/26/2016
  • Est. Priority Date: 03/31/2004
  • Status: Active Grant
First Claim
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1. A method of scribing, dicing, or cutting to remove material from a region of a workpiece having a composite material comprising at least two non-metallic materials having different optical properties, said method comprising:

  • directing laser pulses toward said composite material of said workpiece to scribe, dice, or cut to remove material from the region of the workpiece having said composite material, the composite material comprising at least one portion of matrix and at least one portion of reinforcement in which the matrix surrounds and supports the reinforcement, said composite material comprising reinforced fiber, the laser pulses having at least one pulse width in the range from 10 fs to 500 picoseconds and a pulse repetition rate in the range from 10 kHz to 10 MHz;

    focusing said laser pulses into laser spots to scribe, dice, or cut to remove material from the region of the workpiece having said composite material, said laser spots having spot sizes (1/e2) in a range from 1 micron to 100 μ

    m, wherein at least one said laser pulse provides a power density above a threshold for nonlinear absorption in said reinforced fiber of said composite material at a wavelength of said at least one laser pulse, wherein said power density is in a range from 1012 W/cm2 to 1014 W/cm2; and

    positioning said laser spots relative to said workpiece to scribe, dice, or cut to remove material from the region of the workpiece having said composite material, said positioning such that a spatial overlap between adjacent focused spots (1/e2) for removal of said composite material is sufficient for scribing, dicing, or cutting said workpiece at said wavelength, pulse width, repetition rate, and power density,wherein said method controls heat accumulation within one or more materials of said workpiece region, while limiting accumulation of unwanted material about said region,wherein said scribing, dicing, or cutting said workpiece comprises depthwise removing at least 25 μ

    m up to 150 μ

    m of composite material with said laser pulses in a single pass of laser processing pulses relative to said composite material, with said power density and operation in the nonlinear absorption regime in said composite material.

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