Method and structure for adding mass with stress isolation to MEMS structures
First Claim
1. A method for fabricating a MEMS (micro-electro-mechanical-system) structure including a proof mass apparatus, the method comprising:
- providing a thickness of silicon material coupled to at least one flexible element, the thickness of silicon material being configured to move in one or more spatial directions about the flexible element(s);
forming one or more stress isolation regions in thickness of silicon material in a vicinity of the flexible element;
forming a plurality of recessed regions in respective spatial regions of the thickness of silicon material adjacent the stress isolation regions;
forming a glue material within each of the recessed regions; and
forming a plug material overlying each of the recessed regions;
wherein a proof mass is configured from at least the plug material provided in each of the plug regions in the thickness of silicon material.
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Abstract
A method and structure for adding mass with stress isolation to MEMS. The structure has a thickness of silicon material coupled to at least one flexible element. The thickness of silicon material can be configured to move in one or more spatial directions about the flexible element(s) according to a specific embodiment. The apparatus also includes a plurality of recessed regions formed in respective spatial regions of the thickness of silicon material. Additionally, the apparatus includes a glue material within each of the recessed regions and a plug material formed overlying each of the recessed regions.
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Citations
15 Claims
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1. A method for fabricating a MEMS (micro-electro-mechanical-system) structure including a proof mass apparatus, the method comprising:
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providing a thickness of silicon material coupled to at least one flexible element, the thickness of silicon material being configured to move in one or more spatial directions about the flexible element(s); forming one or more stress isolation regions in thickness of silicon material in a vicinity of the flexible element; forming a plurality of recessed regions in respective spatial regions of the thickness of silicon material adjacent the stress isolation regions; forming a glue material within each of the recessed regions; and forming a plug material overlying each of the recessed regions; wherein a proof mass is configured from at least the plug material provided in each of the plug regions in the thickness of silicon material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for adding mass with stress isolation to a MEMS (micro-electro-mechanical-system) structure, the method comprising:
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providing a thickness of silicon material coupled to at least one flexible element, the thickness of silicon material being configured to move in one or more spatial directions about the flexible element(s); forming one or more stress isolation regions in a vicinity of the flexible element(s); forming a plurality of recessed regions in respective spatial regions of the thickness of silicon material adjacent to the stress isolation regions; forming a glue material within one or more of the recessed regions; and forming a plug material overlying one or more of the recessed regions; wherein a proof mass is configured from at least the plug material provided in each of the plug regions. - View Dependent Claims (13)
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14. A method for adding mass with stress isolation to a MEMS (micro-electro-mechanical-system) structure, the method comprising:
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providing a thickness of silicon material coupled to at least one flexible element which is attached to a MEMS structure, the thickness of silicon material being configured to move in one or more spatial directions about the flexible element(s); forming one or more stress isolation regions in a vicinity of the flexible element(s); forming a plurality of recessed regions in respective spatial regions of the thickness of silicon material adjacent to the stress isolation regions; forming a glue material within one or more of the recessed regions; and forming a plug material overlying one or more of the recessed regions; wherein a proof mass is configured from at least the plug material provided in each of the plug regions. - View Dependent Claims (15)
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Specification