Socket type MEMS bonding

• US 9,321,632 B2
• Filed: 03/11/2014
• Issued: 04/26/2016
• Est. Priority Date: 07/15/2009
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wu, Ting-Hau
• Primary Examiner(s): Gurley, Lynne
• Assistant Examiner(s): Webb, Vernon P
• Application Number:
  US14/204,472
• Publication Number:
  US 20140193949A1
• Time in Patent Office: 777 Days
• Field of Search: 257/414, 257/619, 257/678, 438/106
• US Class Current: 1/1
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate.

Claims

1. A method comprising:

providing a first substrate;

bonding a second substrate to the first substrate, the second substrate including a microelectromechanical system (MEMS) device; and

bonding a third substrate to the first substrate, wherein bonding the third substrate to the first substrate comprises extending a portion of the third substrate through the second substrate, wherein an open space separates a sidewall of the portion of the third substrate from the second substrate.

2. The method of claim 1 wherein bonding the second substrate to the first substrate comprises performing a fusion bonding process or a eutectic bonding process.

3. The method of claim 1 wherein bonding the third substrate to the first substrate comprises performing a fusion bonding process or a eutectic bonding process.

4. The method of claim 1 wherein extending the portion of the third substrate through the second substrate comprises:

forming a socket in the second substrate, wherein a portion of the first substrate is exposed;

forming a stand-off structure in the third substrate; and

aligning the stand-off structure with the socket so that the stand-off structure contacts the exposed portion of the first substrate.

5. The method of claim 4 wherein forming the stand-off structure in the third substrate comprises forming a stand-off structure length slightly larger than a socket length and a stand-off structure width slightly smaller than a socket width.

6. The method of claim 4 wherein forming the socket in the substrate comprises patterning the MEMS device and the socket with a same mask.

7. The method of claim 4 wherein forming the stand-off structure in the third substrate comprises utilizing a single mask.

19. The method of claim 1, wherein the open space separates the sidewall of the portion of the third substrate from the first substrate.

8. A method comprising:

providing a first, second, and third substrate;

bonding the second substrate to the first substrate;

patterning the second substrate to form a MEMS device and a cavity extending through the second substrate to expose a portion of the first substrate;

patterning the third substrate to form a stand-off portion, wherein patterning the second substrate to form the cavity and patterning the third substrate to form the stand-off portion comprises allowing for a space between a wall of the cavity and a wall of the stand-off portion when the stand-off portion contacts the exposed portion of the first substrate through the cavity; and

bonding the third substrate to the first substrate by bringing the stand-off portion in contact with the exposed portion of the first substrate through the cavity.

9. The method of claim 8 wherein bonding the second substrate to the first substrate comprises forming a fusion bond and bonding the third substrate to the first substrate comprises forming a eutectic bonding.

10. The method of claim 8 wherein patterning the second substrate comprises patterning the MEMS device and the cavity with a same mask.

11. The method of claim 8 wherein patterning the third substrate to form a stand-off portion comprises utilizing a single mask.

12. The method of claim 9 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding, and

wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.

20. The method of claim 8, wherein forming the stand-off portion comprises forming a stand-off portion length larger than a cavity length and a stand-off portion width smaller than a cavity width.

13. A method comprising:

providing a first substrate;

positioning a second substrate over the first substrate, the second substrate being distinct from the first substrate and including a microelectromechanical system (MEMS) device and a cavity extending through the second substrate; and

positioning a stand-off portion of a third substrate through the cavity of the second substrate,

wherein a space separates the cavity of the second substrate from the stand-off portion of the third substrate.

14. The method of claim 13 wherein positioning the second substrate over the first substrate includes bonding the second substrate to the first substrate by a fusion bond.

15. The method of claim 14 wherein the fusion bond comprises oxide/silicon bonding or silicon/silicon bonding.

16. The method of claim 13 wherein the stand-off portion of the third substrate is bonded to the first substrate by a eutectic bond.

17. The method of claim 16 wherein the eutectic bond comprises metal/metal bonding or metal/semiconductor bonding.

18. The method of claim 15 wherein the stand-off portion of the third substrate is formed by patterning the third substrate.