Lighting module

• US 9,322,514 B2
• Filed: 10/20/2009
• Issued: 04/26/2016
• Est. Priority Date: 10/31/2008
• Status: Expired due to Fees

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Block, Steffen, Huber, Rainer
• Primary Examiner(s): Ton, Anabel
• Application Number:
  US13/127,235
• Publication Number:
  US 20120092868A1
• Time in Patent Office: 2,380 Days
• Field of Search: 362/249.01
• US Class Current: 1/1
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2105/00 Planar light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A luminous module comprising a plurality of radiation-emitting semiconductor components (2), a connection carrier (3), on which the radiation-emitting semiconductor components (2) are arranged, and a cooling body (6), which, on its front-side surface, is connected to the connection carrier (3) and has a basic body (4) and also a means (5), which is designed to locally alter the thermal resistance of the cooling body (6), wherein the average thermal resistance of the cooling body (6) decreases along a main extension direction of the luminous module (1).

Claims

1. A luminous module comprising:

a plurality of radiation-emitting semiconductor components;

a connection carrier, on which the radiation-emitting semiconductor components are arranged; and

a cooling body, which, on its front-side surface, is connected to the connection carrier and comprises a basic body and a means to locally alter the thermal resistance of the cooling body, wherein;

the average thermal resistance of the cooling body decreases along at least a portion of a main extension direction of the luminous module, the main extension direction being opposite to the direction of a force of gravity when the luminous module is mounted in an upright position,

the means to locally alter the thermal resistance of the cooling body comprises at least one thermally insulating element having a greater thermal resistance than the basic body of the cooling body; and

the at least one thermally insulating element comprises a plurality of thermally insulating elements on a rear-side surface or on at least one side area of the cooling body, a number of thermally insulating elements decreasing per unit area along at least a portion of the main extension direction.

2. The luminous module according to claim 1, wherein the radiation-emitting semiconductor components are distributed uniformly on the connection carrier.

3. The luminous module according to claim 1, wherein the basic body of the cooling body contains a metal or consists of a metal.

4. The luminous module according to claim 1, wherein the means to locally alter the thermal resistance of the cooling body is distributed non-uniformly in the cooling body.

5. The luminous module according to claim 1, wherein the thermally insulating element is formed from a plastics material.

6. The luminous module according to claim 1, wherein the thermally insulating element is a cutout in the basic body of the cooling body, said cutout being filled with a material having a higher thermal resistance than the basic body.

7. The luminous module according to claim 6, wherein the cooling body comprises a plurality of cutouts arranged in regions that are not covered by the radiation-emitting semiconductor components.

8. The luminous module according to claim 1, wherein the means to locally alter the thermal resistance of the cooling body further comprises at least one thermally conductive element having a thermal resistance that is less than or equal to the thermal resistance of the basic body.

9. The luminous module according to claim 8, wherein a second number of thermally conductive elements per unit area increases along at least a portion of the main extension direction.

10. The luminous module according to claim 8, further comprising at least one thermally conductive element arranged on the front-side surface of the cooling body.

11. The luminous module according to claim 10, wherein the at least one thermally conductive element contains a metal or consists of a metal.

12. The luminous module according to claim 1, wherein the means to locally alter the thermal resistance of the cooling body is at least partly a fixing means.

13. A luminous module comprising:

a plurality of radiation-emitting semiconductor components;

a connection carrier on which the radiation-emitting semiconducting components are arranged; and

a cooling body having a front-side surface connected to the connection carrier, the cooling body comprising a basic body and a means to locally alter the thermal resistance of the cooling body;

the luminous module having a main extension direction opposite to the direction of a force of gravity when the luminous module is mounted in an upright position, wherein;

the average thermal resistance of the cooling body decreases along at least a portion of the main extension direction of the luminous module,

the means to locally alter the thermal resistance of the cooling body comprises at least one thermally insulating element having a greater thermal resistance than the basic body of the cooling body, and

the means to locally alter the thermal resistance comprises at least one thermally conductive element having a thermal resistance less than or equal to the thermal resistance of the main body.