Flat panel display integrated with touch screen panel

• US 9,323,372 B2
• Filed: 06/25/2010
• Issued: 04/26/2016
• Est. Priority Date: 12/03/2009
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Kim, Do-Youb, Jang, Brent, Kwak, Won-Kyu, Ku, Ja-Seung, Ahn, Soon-Sung
• Primary Examiner(s): Snyder, Adam J
• Application Number:
  US12/801,795
• Publication Number:
  US 20110134056A1
• Time in Patent Office: 2,132 Days
• Field of Search: 345/173, 345/174, 178/18.06
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A FPD integrated with a touch screen panel includes an upper substrate and a lower substrate facing each other, the upper substrate including a display region and first and second non-display regions surrounding the display region, a plurality of sensing patterns on the display region of the upper substrate, a plurality of sensing lines on the first non-display region of the upper substrate, a sealing material on the second non-display region of the upper substrate, the sealing material connecting the upper and lower substrates, and a flexible printed circuit (FPC) bonding pad unit on the second non-display region of the upper substrate, the FPC bonding pad unit including a plurality of bonding pads coupled to the plurality of sensing lines, the bonding pads including a transparent conductive material in regions overlapping the sealing material.

Claims

1. A flat panel display (FPD) integrated with a touch screen panel, comprising:

an upper substrate and a lower substrate facing each other, the upper substrate including a display region and first and second non-display regions surrounding the display region;

a plurality of sensing patterns on the display region of the upper substrate;

a plurality of sensing lines on the first non-display region of the upper substrate;

a flexible printed circuit (FPC) bonding pad unit including a transparent conductive material on the second non-display region of the upper substrate; and

a sealing material on the second non-display region of the upper substrate, the sealing material connecting the upper and lower substrates and overlapping the FPC bonding pad unit,

wherein the FPC bonding pad unit includes a plurality of bonding pads directly coupled to the plurality of sensing lines, the bonding pads including the transparent conductive material in regions overlapping the sealing material.

2. The FPD as claimed in claim 1, wherein each bonding pad of the plurality of bonding pads includes a first region that overlaps the sealing material and a second region that does not overlap the sealing material, structures of the first and second regions in each of the bonding pads being different from each other.

3. The FPD as claimed in claim 2, wherein the first region of the bonding pad includes:

a first insulating layer on the second non-display region of the upper substrate, the first insulating layer including an opening;

a transparent conductive pattern in the opening of the first insulating layer; and

a second insulating layer on the first insulating layer and exposing the transparent conductive pattern.

4. The FPD as claimed in claim 3, wherein the transparent conductive pattern and the sensing patterns include a substantially same material.

5. The FPD as claimed in claim 3, further comprising island-shaped opaque metal patterns under the transparent conductive pattern.

6. The FPD as claimed in claim 3, further comprising slit-shaped opaque metal patterns under the transparent conductive pattern.

7. The FPD as claimed in claim 3, wherein the second region of the bonding pad includes:

an opaque metal pattern on the second non-display region of the upper substrate;

a first insulating layer on the second non-display region of the upper substrate, the first insulating layer exposing the opaque metal pattern;

the transparent conductive pattern on the exposed opaque metal pattern, the transparent conductive pattern extending from the first region to the second region; and

a second insulating layer on the first insulating layer and exposing the transparent conductive pattern.

8. The FPD as claimed in claim 7, wherein the opaque metal pattern and the sensing lines include a substantially same material.

9. The FPD as claimed in claim 7, wherein the opaque metal pattern is separated from the sealing material by a predetermined distance.

10. The FPD as claimed in claim 9, wherein the predetermined distance is about 100 μ

m.

11. The FPD as claimed in claim 2, wherein the transparent conductive material of the bonding pads extends continuously from the first region to the second region on the upper substrate, at least a portion of the transparent conductive material in the first region being directly on the upper substrate, and an opaque metal pattern being positioned between the transparent conductive material and the upper substrate in the second region.

12. The FPD as claimed in claim 1, wherein portions of the bonding pads overlapping the sealing material on the second non-display region of the upper substrate include only the transparent conductive material.

13. The FPD as claimed in claim 1, wherein the sensing lines are coupled to the bonding pads via opaque metal patterns, the metal patterns being positioned not to overlap the sealing material.

14. The FPD as claimed in claim 1, wherein the sensing lines are coupled to the bonding pads via metal patterns, the bonding pads extending along a first direction, and the metal patterns being spaced apart from the sealing material along the first direction.

15. The FPD as claimed in claim 1, wherein portions of the bonding pads overlapping the sealing material and including the transparent conductive material are directly on the upper substrate.

16. The FPD as claimed in claim 1, wherein the sensing patterns include X sensing patterns and Y sensing patterns in different layers.

17. The FPD as claimed in claim 16, wherein the X sensing patterns are coupled to each other in a first direction, and the Y sensing patterns are coupled to each other in a second direction that intersects the first direction.

18. The FPD integrated with a touch screen panel as claimed in claim 1, wherein the transparent conductive material of the bonding pads is configured to transmit laser light irradiation therethrough toward the sealing material.

19. The FPD as claimed in claim 1, wherein the sealing material is only in a region overlapping the second non-display region of the upper substrate.

20. The FPD as claimed in claim 19, wherein the transparent conductive material of the bonding pads extends along an entire width of the sealing material, the width of the sealing material extending along a direction of a line connecting one sensing line to a respective bonding pad.

21. A flat panel display (FPD) integrated with a touch screen panel, comprising:

an upper substrate and a lower substrate facing each other, the upper substrate including a display region and first and second non-display regions surrounding the display region;

a plurality of sensing patterns on the display region of the upper substrate;

a plurality of sensing lines on the first non-display region of the upper substrate;

a sealing material on the second non-display region of the upper substrate, the sealing material connecting the upper and lower substrates; and

a flexible printed circuit (FPC) bonding pad unit on the second non-display region of the upper substrate, the FPC bonding pad unit including a plurality of bonding pads coupled to the plurality of sensing lines, the bonding pads including a transparent conductive material in regions overlapping the sealing material,

wherein each bonding pad of the plurality of bonding pads includes a first region that overlaps the sealing material and a second region that does not overlap the sealing material, structures of the first and second regions in each of the bonding pads being different from each other,

wherein the first region of the bonding pad includes;

a first insulating layer on the second non-display region of the upper substrate, the first insulating layer including an opening,

a transparent conductive pattern in the opening of the first insulating layer, and

a second insulating layer on the first insulating layer and exposing the transparent conductive pattern, and

wherein the second region of the bonding pad includes;

an opaque metal pattern on the second non-display region of the upper substrate, the opaque metal pattern being separated from the sealing material by about 100 μ

m,

a first insulating layer on the second non-display region of the upper substrate, the first insulating layer exposing the opaque metal pattern,

the transparent conductive pattern on the exposed opaque metal pattern, the transparent conductive pattern extending from the first region to the second region, and

a second insulating layer on the first insulating layer and exposing the transparent conductive pattern.