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Substrate processing system and method

  • US 9,324,598 B2
  • Filed: 11/08/2012
  • Issued: 04/26/2016
  • Est. Priority Date: 11/08/2011
  • Status: Active Grant
First Claim
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1. A substrate processing system, comprising:

  • a processing chamber defining a processing zone;

    a first chuck array coupled to a first transport mechanism positioned on a first side, wherein the first chuck array is configured to be linearly movable back and forth on the first transport mechanism, thereby traversing the processing zone;

    a second chuck array coupled to a second transport mechanism positioned on a second side, opposite the first side, wherein the second chuck array is configured to be linearly movable back and forth on the second transport mechanism, thereby traversing the processing zone;

    and wherein each of the first and second transport mechanism is configured to be movable in elevation direction to enable one of the first and second chuck arrays to pass below the other one of the first and second chuck arrays;

    wherein the first transport mechanism comprises;

    a first rail assembly positioned inside the vacuum enclosure on one side of the processing chamber;

    a first elevation mechanism coupled to the first rail assembly and configured to raise the first rail assembly to elevated position and lower the first rail assembly to lower position;

    wherein the second transport mechanism comprises;

    a second rail assembly positioned inside the vacuum enclosure on opposite side of the first rail assembly;

    a second elevation mechanism coupled to the second rail assembly and configured to raise the second rail assembly to elevated position and lower the second rail assembly to lower position;

    wherein the first chuck array is positioned on a first cantilevered shelf configured to ride on the first rail assembly; and

    ,wherein the second chuck array is positioned on a second cantilevered shelf configured to ride on the second rail assembly.

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