Substrate processing system and method
First Claim
1. A substrate processing system, comprising:
- a processing chamber defining a processing zone;
a first chuck array coupled to a first transport mechanism positioned on a first side, wherein the first chuck array is configured to be linearly movable back and forth on the first transport mechanism, thereby traversing the processing zone;
a second chuck array coupled to a second transport mechanism positioned on a second side, opposite the first side, wherein the second chuck array is configured to be linearly movable back and forth on the second transport mechanism, thereby traversing the processing zone;
and wherein each of the first and second transport mechanism is configured to be movable in elevation direction to enable one of the first and second chuck arrays to pass below the other one of the first and second chuck arrays;
wherein the first transport mechanism comprises;
a first rail assembly positioned inside the vacuum enclosure on one side of the processing chamber;
a first elevation mechanism coupled to the first rail assembly and configured to raise the first rail assembly to elevated position and lower the first rail assembly to lower position;
wherein the second transport mechanism comprises;
a second rail assembly positioned inside the vacuum enclosure on opposite side of the first rail assembly;
a second elevation mechanism coupled to the second rail assembly and configured to raise the second rail assembly to elevated position and lower the second rail assembly to lower position;
wherein the first chuck array is positioned on a first cantilevered shelf configured to ride on the first rail assembly; and
,wherein the second chuck array is positioned on a second cantilevered shelf configured to ride on the second rail assembly.
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Accused Products
Abstract
A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.
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Citations
19 Claims
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1. A substrate processing system, comprising:
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a processing chamber defining a processing zone; a first chuck array coupled to a first transport mechanism positioned on a first side, wherein the first chuck array is configured to be linearly movable back and forth on the first transport mechanism, thereby traversing the processing zone; a second chuck array coupled to a second transport mechanism positioned on a second side, opposite the first side, wherein the second chuck array is configured to be linearly movable back and forth on the second transport mechanism, thereby traversing the processing zone; and wherein each of the first and second transport mechanism is configured to be movable in elevation direction to enable one of the first and second chuck arrays to pass below the other one of the first and second chuck arrays; wherein the first transport mechanism comprises; a first rail assembly positioned inside the vacuum enclosure on one side of the processing chamber; a first elevation mechanism coupled to the first rail assembly and configured to raise the first rail assembly to elevated position and lower the first rail assembly to lower position; wherein the second transport mechanism comprises; a second rail assembly positioned inside the vacuum enclosure on opposite side of the first rail assembly; a second elevation mechanism coupled to the second rail assembly and configured to raise the second rail assembly to elevated position and lower the second rail assembly to lower position; wherein the first chuck array is positioned on a first cantilevered shelf configured to ride on the first rail assembly; and
,wherein the second chuck array is positioned on a second cantilevered shelf configured to ride on the second rail assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 18, 19)
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- 11. The system of claim further comprising a wafer delivery mechanism positioned inside the vacuum enclosure and a wafer removal mechanism positioned inside the vacuum enclosure.
Specification