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Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

  • US 9,324,626 B2
  • Filed: 12/02/2014
  • Issued: 04/26/2016
  • Est. Priority Date: 03/12/2014
  • Status: Active Grant
First Claim
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1. A circuit assembly comprising a plurality of levels “

  • Li”

    where Li varies from L0 through Ln, i being an integer varying from 0 to n, wherein n is an integer greater than one, the circuit assembly comprising a substrate whose top side comprises a cavity comprising a bottom wall;

    wherein the level L0 comprises;

    the bottom wall;

    a plurality of through-holes each of which passes through the bottom wall;

    a plurality of conductors (“

    L0 conductors”

    ) in respective through-holes;

    wherein at least part of level L1 overlies at least part of level L0, and wherein level L1 comprises one or more circuit modules each of which has one or more contact pads each of which is electrically connected to one or more L0 conductors;

    wherein for each level Li other than L0 and L1;

    at least part of level Li overlies at least part of level Li-1;

    each level Li comprises one or more circuit modules each of which has one or more contact pads each of which is electrically connected to one or more L0 conductors by one or more first electrically conductive paths lying in the cavity, each first electrically conductive path passing through each level L1 through Li-1;

    wherein at least one first electrically conductive path passes through more than one of the levels L1 through Ln-1.

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