Tooling for coupling multiple electronic chips
First Claim
1. A method for use with multiple chips, wherein each of the multiple chips has a bonding surface including electrical contacts and a surface on a side opposite the bonding surface, the method comprising:
- bringing a hardenable material located on a body into contact with the multiple chips at a first location;
hardening the hardenable material to increasingly constrain at least a portion of each of the multiple chips therewithin such that the hardened hardenable material and the multiple chips behave as a rigid body;
moving the multiple chips constrained by the hardened hardenable material from the first location to a second location where an element, to which the multiple chips are to be bonded, is located;
applying a force to the body so that the hardened hardenable material will uniformly transfer a force from the body to the multiple chips to bring, under pressure, the bonding surface of each individual chip into contact with a bonding surface of the element at the second location, without causing damage to the multiple chips or the bonding surface of the element; and
removing all of the hardened hardenable material from contact with the multiple chips.
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Accused Products
Abstract
A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.
333 Citations
21 Claims
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1. A method for use with multiple chips, wherein each of the multiple chips has a bonding surface including electrical contacts and a surface on a side opposite the bonding surface, the method comprising:
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bringing a hardenable material located on a body into contact with the multiple chips at a first location; hardening the hardenable material to increasingly constrain at least a portion of each of the multiple chips therewithin such that the hardened hardenable material and the multiple chips behave as a rigid body; moving the multiple chips constrained by the hardened hardenable material from the first location to a second location where an element, to which the multiple chips are to be bonded, is located; applying a force to the body so that the hardened hardenable material will uniformly transfer a force from the body to the multiple chips to bring, under pressure, the bonding surface of each individual chip into contact with a bonding surface of the element at the second location, without causing damage to the multiple chips or the bonding surface of the element; and removing all of the hardened hardenable material from contact with the multiple chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 21)
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14. A method for bonding a plurality of chips to an element, wherein each of the plurality of chips has a bonding surface that includes electrical contacts, the method comprising:
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bringing a hardenable material that is disposed on a body into contact with the plurality of chips at a first location; hardening the hardenable material to increasingly constrain at least a portion of each of the plurality of chips such that the hardened hardenable material and the plurality of chips behave as a rigid body; after said hardening, moving the plurality of chips from the first location to a second location where the element is located, wherein the second location is different from the first location; applying a force to the body at the second location to cause the hardened hardenable material to transfer the force from the body to the plurality of chips for bonding the bonding surfaces of the plurality of chips to a bonding surface of the element; and removing all of the hardened hardenable material from contact with the plurality of chips. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification