Open source power quad flat no-lead (PQFN) package

• US 9,324,646 B2
• Filed: 12/10/2013
• Issued: 04/26/2016
• Est. Priority Date: 12/13/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG)
• Original Assignee: Infineon Technologies AG
• Inventors: Fernando, Dean, Barbosa, Roel, Takahashi, Toshio
• Primary Examiner(s): Gumedzoe, Peniel M
• Application Number:
  US14/102,379
• Publication Number:
  US 20140097498A1
• Time in Patent Office: 868 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 : Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 27/088 : the components being field-effect transistors with insulated gate
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13064 : High Electron Mobility Transistor [HEMT, HFET [heterostructure FET], MODFET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase, V-phase, and W-phase power switches situated on the PQFN leadframe. A drain of the U-phase power switch is connected to a U-phase output strip of the PQFN leadframe. A source of the U-phase power switch is connected to a U-phase current sense terminal. The U-phase output strip can substantially traverse across the PQFN leadframe. Another U-phase power switch is situated on the PQFN leadframe with a source of the another U-phase power switch connected to the U-phase output strip of the PQFN leadframe. The PQFN leadframe can include a leadframe island within the U-phase output strip. At least one wirebond may be connected to the U-phase output strip.

Claims

1. A power quad flat no-lead (PQFN) package comprising:

U-phase, V-phase, and W-phase power switches situated on a leadframe;

said U-phase power switch being the only power switch situated on a U-phase output strip of said leadframe;

a drain of said U-phase power switch being connected to said U-phase output strip of said leadframe;

wherein said U-phase output strip substantially traverses across said leadframe;

a source of said U-phase power switch being connected to a U-phase current sense terminal.

2. The (PQFN) package of claim 1, wherein a V-phase output strip substantially traverses across said leadframe.

3. The (PQFN) package of claim 1 comprising a first leadframe island within said U-phase output strip.

4. The (PQFN) package of claim 1 comprising at least one wirebond connected to said U-phase output strip.

5. The (PQFN) package of claim 1 comprising another U-phase power switch situated on said leadframe, a source of said another U-phase power switch connected to said U-phase output strip of said leadframe.

6. The (PQFN) package of claim 1, comprising at least one wirebond connecting said source of said U-phase power switch to said U-phase current sense terminal.

7. The (PQFN) package of claim 1, wherein said U-phase power switch is situated on a U-phase output pad of said leadframe.

8. The (PQFN) package of claim 1 comprising a driver integrated circuit (IC) situated on said leadframe and connected to gates of said U-phase, V-phase, and W-phase power switches.

9. The (PQFN) package of claim 1, wherein said U-phase, V-phase, and W-phase power switches comprise group 111-V transistors.

10. The (PQFN) package of claim 1, wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.

11. The (PQFN) package of claim 1, wherein said PQFN package has a footprint of less than 12 mm by 12 mm.

12. A power quad flat no-lead (PQFN) package comprising:

U-phase, V-phase, and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip, a V-phase output strip, and a W-phase output pad of said leadframe;

said U-phase power switch being the only power switch situated on said U-phase output strip of said leadframe;

said U-phase output strip, said V-phase output strip, and said W-phase output pad being respectively connected to drains of said U-phase, said V-phase, and said W-phase power switches;

wherein said U-phase output strip substantially traverses across said leadframe;

sources of said U-phase, said V-phase, and said W-phase power switches being respectively connected to U-phase, V-phase, and W-phase current sense terminals.

13. The (PQFN) package of claim 12, wherein said V-phase output strip substantially traverses across said leadframe.

14. The (PQFN) package of claim 12 comprising a first leadframe island within said U-phase output strip and a second leadframe island within said V-phase output strip.

15. The (PQFN) package of claim 12, comprising at least one wirebond connecting said source of said V-phase power switch to said V-phase current sense terminal.

16. The (PQFN) package of claim 12 comprising another U-phase power switch and another V-phase power switch situated on said leadframe, a source of said another U-phase power switch connected to said U-phase output strip and a source of said another V-phase power switch connected to said V-phase output strip.

17. The (PQFN) package of claim 12, wherein said U-phase power switch is situated on a U-phase output pad of said leadframe and said V-phase power switch is situated on a V-phase output pad of said leadframe.

18. A power quad flat no-lead (PQFN) package, including a single driver integrated circuit (IC), said PQFN package comprising:

U-phase, V-phase, and W-phase power switches situated on a leadframe and respectively connected to a U-phase output strip, a V-phase output strip, and a W-phase output pad of said leadframe;

said U-phase power switch being the only power switch situated on said U-phase output strip of said leadframe;

said U-phase output strip, said V-phase output strip, and said W-phase output pad being respectively connected to drains of said U-phase, said V-phase, and said W-phase power switches;

wherein said U-phase output strip substantially traverses across said leadframe;

sources of said U-phase, said V-phase, and said W-phase power switches being respectively connected to U-phase, V-phase, and W-phase current sense terminals;

said single driver IC situated on a driver IC pad of said leadframe, said single driver IC being connected to said U-phase output strip and to said V-phase output strip.

19. The (PQFN) package of claim 18, wherein said V-phase output strip substantially traverses across said leadframe.