Methods and apparatus for conductive element deposition and formation

• US 9,325,060 B2
• Filed: 02/11/2015
• Issued: 04/26/2016
• Est. Priority Date: 02/12/2014
• Status: Active Grant

• Current Assignee: Pulse Finland Oy (Yageo Corporation)
• Original Assignee: Pulse Finland Oy (Yageo Corporation)
• Inventors: Kalistaja, Esa, Galla, Elli, Kuehler, Dan, Childers, Winthrop
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): LINDGREN BALTZELL, ANDREA J
• Application Number:
  US14/620,108
• Publication Number:
  US 20150229025A1
• Time in Patent Office: 440 Days
• Field of Search: 343/700.MS
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H05K 2201/0245 Flakes, flat particles or lamellar particles
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/125 by ink-jet printing

Abstract

A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a “thick” antenna element can be formed in one pass of a dispensing head or nozzle, thereby reducing manufacturing cost and increasing manufacturing efficiency.

Claims

1. A method of forming an assembly having at least one conductive trace, the method implemented using an apparatus configured to eject drops of a conductive fluid comprising:

providing a substrate upon which the at least one conductive trace is to be deposited;

causing transport of at least a portion of the apparatus over a surface of the substrate while ejecting a plurality of conductive fluid drops to form the at least one conductive trace, each of the plurality of conductive fluid drops comprising a volume of at least 500 pL; and

heating at least the at least one conductive trace to remove at least a portion of the plurality of conductive fluid drops so as to render the at least one trace substantially permanent on said substrate.

2. The method of claim 1, wherein said forming an assembly having the at least one conductive trace comprises forming at least a portion of said at least one conductive trace having a thickness in a range of 20 μ

m to 100 μ

m.

3. The method of claim 1, wherein said apparatus configured to eject drops comprises a printhead including a nozzle.

4. The method of claim 3, wherein said conductive fluid comprises a plurality of conductive silver flakes contained within a fluid vehicle.

5. The method of claim 4, wherein 95% by weight of the plurality of silver flakes have a major dimension in a range of 2 μ

m to 20 μ

m.

6. The method of claim 5, wherein said substrate comprises at least a portion of a mobile electronic wireless device, and at least a portion of said at least one conductive trace comprises an antenna capable of transmitting and receiving electromagnetic energy.

7. The method of claim 1, wherein said ejecting the plurality of conductive fluid drops comprises ejecting drops having a dry volume that is in the range of 500 pL to 5000 pL.

8. The method of claim 1, wherein each drop of conductive fluid ejected by the apparatus has a dry volume that is in the range of 1000 pL to 2000 pL.

9. The method of claim 1, further comprising utilizing an adhesion promoter disposed in or on at least one of:

(i) said substrate, and/or (ii) said conductive fluid, to promote adhesion of said at least one trace to said substrate.

10. The method of claim 1, wherein said causing transport of at least a portion of apparatus over a surface of the substrate while ejecting a plurality of conductive fluid drops to form the at least one conductive trace comprises using a plurality of individual strokes or motions while performing said ejecting, and said method further comprises varying at least one temporal relationship between at least two of the strokes or motions so as to achieve a desired physical property of said conductive trace before said heating.

11. An article of manufacture including an antenna formed upon a surface of a substrate, the antenna formed by a method comprising:

providing a printhead including a nozzle that is configured to eject drops of a conductive fluid and not entrain said drops in a gaseous vehicle, the conductive fluid including conductive silver flakes in a fluid vehicle, each of the drops of the conductive fluid comprising a volume greater than or equal to 500 pL, whereby 95% by weight of the silver flakes have a major dimension in a range of 2 μ

m to 20 μ

m;

securing the article in a fixture;

transporting the printhead over a surface of the article while ejecting drops of the conductive fluid to form a fluid trace; and

heating the fluid trace in an oven to remove at least a portion of the fluid vehicle, whereby a resultant trace comprises a thickness in a range of 20 μ

m to 100 μ

m.

12. The article of manufacturing of claim 11, wherein the resultant trace comprises a thickness in the range of 20 μ

m to 60 μ

m, and the thickness is configured to be at least two times that of a skin depth measured at 1 Ghz.

13. The article of manufacturing of claim 11, wherein the resultant trace comprises a thickness in the range of 30 μ

m to 40 μ

m, and the thickness is configured to be at least two times that of a skin depth measured at 1 Ghz.

14. The article of manufacturing of claim 11, wherein a skin depth measured at 1 Ghz is within a range of 4 μ

m to 15 μ

m.

15. The article of manufacturing of claim 11, wherein a skin depth measured at 1 Ghz is within a range of 8 μ

m to 15 μ

m.

16. The article of manufacturing of claim 11, wherein a single pass of the printhead results in a dry trace thickness of at least 20 μ

m to 100 μ

m, the thickness which is at least two times that of a skin depth measured at 1 Ghz.

17. The article of manufacture of claim 11, wherein each of a majority of the drops of the conductive fluid ejected by the printhead has a dry volume that is in a range of 500 pL and 5000 pL.

18. The article of manufacture of claim 17, wherein the each of the majority of the drops of the conductive fluid ejected by the printhead has a dry volume that is in a range of 1000 pL to 2000 pL.

19. The article of manufacture of claim 17, wherein the each of the majority of the drops of the conductive fluid is ejected onto the substrate and has a diameter in a range of 100 μ

m to 1000 μ

m.

20. The article of manufacture of claim 11, wherein the conductive fluid comprises the silver flakes, and wherein 95% of the silver flakes by weight have a major dimension between 6 μ

m and 16 μ

m inclusive.

21. The article of manufacture of claim 11, wherein the conductive fluid contains a plurality of silver flakes, 95% of the plurality of silver flakes by weight having a major dimension between 10 μ

m and 12 μ

m inclusive.

22. The article of manufacture of claim 11, wherein a fluid viscosity of the conductive fluid is in a range of 10 poise to 80 poise inclusive at 25 degree Celsius.

23. The article of manufacture of claim 11, wherein a fluid viscosity of the conductive fluid is in a range of 30 poise to 50 poise inclusive at 25 degree Celsius.

24. The article of manufacture of claim 11, wherein the nozzle has an exit diameter in a range of 50 μ

m to 300 μ

m inclusive.

25. The article of manufacture of claim 11, wherein the nozzle has an exit diameter between 70 μ

m and 200 μ

m inclusive.

26. An article of manufacture including an antenna formed upon a surface of a substrate using a printhead, the printhead including a nozzle that is configured to eject drops of a conductive fluid, each of the drops of the conductive fluid comprising a volume of 500 to 10,000 pL, the conductive fluid including conductive silver flakes in a fluid vehicle, whereby 95% by weight of the silver flakes have a major dimension in a range of 2 μ

m to 20 μ

m, the method comprising;

securing the article in a fixture;

transporting the printhead over a surface of the article while ejecting the drops of the conductive fluid to form a fluid trace, whereby each pass of the printhead forms a path segment comprising a dry trace thickness that is in a range of 20 μ

m to 100 μ

m and is at least two times a skin depth of a dry trace at an operating frequency of 1 GHz; and

heating the fluid trace in an oven to remove at least a portion of the fluid vehicle.

27. The article of manufacturing of claim 26, wherein the dry trace thickness is at least three times that of the skin depth measured at 1 GHz.

28. The article of manufacturing of claim 27, wherein the dry trace comprises a thickness in the range of 30 μ

m to 50 μ

m inclusive.

29. The article of manufacturing of claim 27, wherein:

the skin depth measured at 1 Ghz is within a range of 4 μ

m to 15 μ

m inclusive; and

95% by weight of the silver flakes have a major dimension in a range of 6 μ

m to 16 μ

m inclusive.

30. A method of forming a conductive element on at least one surface of a substrate, the method comprising:

ejecting a plurality of portions of a flowable conductive material, each of the plurality of portions of the flowable conductive material comprising a volume of at least 500 pL and comprising a plurality of at least partly metallic flakes entrained in a fluid vehicle onto the substrate via at least one pass of a dispensing apparatus configured to perform said ejecting, the ejecting forming the conductive element so as to at least meet or exceed a prescribed ratio between a skin depth of the conductive element and an overall depth thereof at a prescribed frequency; and

curing said conductive element and said substrate as a unit so as to drive out at least a portion of said fluid vehicle from said conductive element, and render said conductive element at least substantially permanent.