Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor

• US 9,327,965 B2
• Filed: 03/12/2014
• Issued: 05/03/2016
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Versana Micro Inc.
• Original Assignee: Versana Micro Inc.
• Inventors: Gogoi, Bishnu Prasanna
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US14/207,443
• Publication Number:
  US 20140264659A1
• Time in Patent Office: 783 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0207 Bolometers
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2201/0228 Inertial sensors
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/05 Arrays
• CPC Class Codes: B81B 2207/09 Packages
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: H01L 27/14 including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation radiation-sensitive components structurally associated with one or more electric light sources only H01L31/14; couplings of light guides with optoelectronic elements G02B6/42
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: H10B 61/00 Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
• CPC Class Codes: H10N 19/00 Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/308 Membrane type
• CPC Class Codes: H10N 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00 MRAM devices H10B61/00

Abstract

A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

Claims

1. A transportation device configured to transport at least one person that is configured to couple to a wireless network comprising

a first integrated circuit comprising:

a first sensor configured to measure a first parameter;

a second sensor configured to measure a second parameter; and

a third sensor configured to measure a third parameter wherein the first, second, and third parameters are different and wherein the first integrated circuit is coupled to the transportation device.

2. The transportation device of claim 1 a second integrated circuit having at least one sensor wherein the second integrated circuit is coupled to the first integrated circuit via conductive bonds or wirebonds.

3. The transportation device of claim 1 a third integrated circuit having control circuitry wherein the first integrated circuit is coupled to the first integrated circuit via conductive bonds or wirebonds.

4. The transportation device of claim 1 wherein the first sensor is exposed to an external environment and wherein the second sensor is sealed from the external environment.

5. The transportation device of claim 1 wherein the first integrated circuit of the transportation device includes a layer in common to the first and the second sensors, wherein at least a portion of the layer is etched, wherein the layer seals a cavity in the first sensor, wherein the layer seals a cavity in the second sensor, wherein a volume of the cavity of the first sensor is fixed, and wherein a volume of the cavity of the second sensor is configured to vary according to a stimulus.

6. The transportation device of claim 1 wherein the first integrated circuit has a layer in common to the first and the second sensors, wherein at least a portion of the layer is etched, wherein the layer seals a cavity in the first sensor, wherein the layer includes an opening exposing the second sensor the second sensor to an external environment.

7. The transportation device of claim 1 wherein at least two of the first, second, or third sensors of the first integrated circuit are sealed from an external environment.

8. The transportation device of claim 1 wherein the first and the second sensors of the first integrated circuit are sealed from an external environment and wherein the first and the second sensors are sealed having a different pressure.

9. The transport device of claim 1 wherein at least one sensor of the first integrated circuit is sealed by one or more deposited layers.

10. The transportation device of claim 1 wherein the one or more deposited layers comprise at least one of polycrystalline silicon, epitaxially deposited silicon, amorphous silicon, silicon germanium, germanium, silicon nitride, silicon oxynitride, silicon carbide, metal, polyimide, or parylene.

11. The transportation device of claim 1 wherein at least one of the first, second, or third sensors of the first integrated circuit is sealed by depositing a layer using at least one of low pressure chemical vapor deposition, plasma enhanced chemical vapor deposition, atmospheric pressure chemical vapor deposition, sub atmospheric chemical vapor deposition, physical vapor deposition, atomic layer deposition, metallo organic chemical vapor deposition, or molecular beam epitaxy or wherein the first sensor can be sealed using one of sputtering, evaporating, spin-coating, electro-plating, or spray coating a material on the integrated circuit.

12. The transportation device of claim 1 wherein the first sensor and the second sensor of the first integrated circuit are MEMs sensors.

13. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise an accelerometer, pressure sensor, and a microphone.

14. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise a pressure sensor, a gyroscope, and a microphone.

15. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise an accelerometer, a pressure sensor, and a humidity sensor.

16. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise a pressure sensor, an accelerometer, and an infra-red sensor.

17. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise an accelerometer, a pressure sensor, and a magnetic sensor.

18. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise a pressure sensor, a microphone, and a magnetic sensor.

19. The integrated circuit of claim 1 wherein the first, second, and third sensors respectively comprise an accelerometer, a pressure sensor, and a temperature sensor.

20. The integrated circuit of claim 1 wherein at least one of the first, second, or third sensors is a chemical sensor.

21. The transportation device of claim 1 wherein the transportation device is configured to display or transmit measurement data from the first integrated circuit.

22. The transportation device of claim 1 wherein the first integrated circuit includes a fourth sensor configured to measure a fourth parameter.

23. The transportation device of claim 1 wherein the transportation device is housed in the transportation device.

24. The transportation device of claim 1 wherein the first integrated circuit includes a fourth sensor configured to measure a fourth parameter wherein the first, second, third, and fourth parameters are different.

25. The transportation device of claim 1 wherein the first integrated circuit includes:

a fourth sensor configured to measure a fourth parameter; and

a fifth sensor configured to measure a fifth parameter wherein the first, second, third, fourth, and fifth parameters are different.

26. The transportation device of claim 1 wherein the first integrated circuit includes:

a fourth sensor configured to measure a fourth parameter;

a fifth sensor configured to measure a fifth parameter; and

a sixth sensor configured to measure a sixth parameter wherein the first, second, third, fourth, fifth, and sixth parameters are different.

27. The transportation device of claim 1 wherein the first integrated circuit includes:

a fourth sensor configured to measure a fourth parameter;

a fifth sensor configured to measure a fifth parameter;

a sixth sensor configured to measure a sixth parameter; and

a seventh sensor configured to measure a seventh parameter wherein the first, second, third;

fourth, fifth, sixth, and seventh parameters are different.

28. A transportation device configured to transport at least one person that is configured to couple to a wireless network comprising:

a first integrated circuit comprising;

a first MEMs sensor wherein the first MEMs sensor is exposed to an external environment; and

a second MEMs sensor; and

a third sensor wherein the first, second, and third sensors each measure a different parameter and wherein the first integrated circuit is coupled to a transportation device.

29. The transportation device of claim 28 further including a second integrated circuit comprising at least one sensor, wherein the second integrated circuit is coupled to the first integrated circuit via conductive bonds or wire bonds.

30. The transportation device of claim 28 further including a third integrated circuit wherein the second integrated circuit includes control circuitry and wherein the first integrated circuit is coupled to the second integrated circuit via conductive bonds or wire bonds.

31. The transportation device of claim 28 wherein the first MEMs sensor is configured to be exposed to an external environment to receive a first parameter and wherein the second MEMs sensor is sealed from the external environment.

32. The transportation device of claim 28 wherein the first MEMs sensor and the second MEMs sensor of the first integrated circuit are sealed from an external environment and wherein the first MEMs sensor and the second MEMs sensor are sealed having a different pressure.

33. The transportation device of claim 28 wherein the first integrated circuit includes at least two sensors having a layer in common, wherein the layer is configured flex in one of the at least two sensors, and wherein the layer is configured not to flex in the other of the at least two sensors.

34. The transportation device of claim 28 wherein the first MEMs sensor and the second MEMs sensor has a layer in common and where in the layer forms a cap on the first MEMs sensor and wherein the layer forms a moving plate on the second MEMs.

35. The transportation device of claim 28 wherein the first MEMs sensor and the second MEMs sensor has a layer in common that seals a cavity in the first MEMs sensor and seals a cavity in the second MEMs sensor wherein the volume of the cavity of first MEMs sensor is fixed and wherein the volume of the cavity of the second MEMs sensor is configured to vary according to stimulus.

36. A transportation device configured to transport at least one person that is configured to couple to a wireless network comprising:

a first integrated circuit comprising;

a first MEMs sensor wherein the first MEMs sensor is exposed to an external environment; and

a second MEMs sensor wherein the second MEMs sensor is sealed from the external environment, wherein the first and second MEMs sensors measure a different parameter, and wherein the first integrated circuit is coupled to the transportation device.

37. The transportation device of claim 36 further including a second integrated circuit comprising at least one sensor, wherein the second integrated circuit is coupled to the first integrated circuit via conductive bonds or wire bonds.