CMOS NFET and PFET comparable spacer width

• US 9,330,983 B1
• Filed: 02/16/2015
• Issued: 05/03/2016
• Est. Priority Date: 02/16/2015
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Cheng, Kangguo, Ok, Injo, Seo, Soon-Cheon
• Primary Examiner(s): Ullah, Elias M
• Application Number:
  US14/622,957
• Time in Patent Office: 442 Days
• Field of Search: 257/369
• US Class Current: 1/1
• CPC Class Codes: H01L 21/823814 with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
• CPC Class Codes: H01L 21/823828 with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
• CPC Class Codes: H01L 21/823864 with a particular manufacturing method of the gate sidewall spacers, e.g. double spacers, particular spacer material or shape
• CPC Class Codes: H01L 27/092 complementary MIS field-effect transistors
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 29/66636 with source or drain recessed by etching or first recessed by etching and then refilled

Abstract

A method including forming a p-type field effect transistor (pFET device) and an n-type field effect transistor (nFET device) each having sidewall spacers on opposite sidewalls of a dummy gate, conformally forming a first liner on the nFET device and depositing a fill material directly on the first liner of the nFET device, protecting the nFET device while growing an epitaxy in a source drain region of the pFET device, conformally forming a second liner above and in direct contact with the pFET device, including the epitaxy in the source drain regions of the pFET device, and along a vertical sidewall of a remaining portion of the fill material above the nFET device, depositing a first inter level dielectric above the second liner, and protecting the pFET device and the first inter level dielectric while growing a second epitaxy in a source drain region of the nFET device.

Claims

1. A method comprising:

forming a p-type field effect transistor (pFET device) and an n-type field effect transistor (nFET device), each having sidewall spacers on opposite sidewalls of a dummy gate, and source drain regions adjacent to the sidewall spacers;

conformally forming a first liner on the sidewall spacers of both the pFET device and the nFET device;

depositing a fill material directly above and in direct contact with the first liner, such that an upper surface of the fill material is substantially flush with an upper surface of a portion of the first liner above the dummy gates of both the pFET device and the nFET device;

removing a portion of the fill material and a portion of the first liner to expose only the pFET device, an etch rate of the first liner is substantially different from an etch rate of the sidewall spacers of the pFET device, such that the portion of the first liner is removed in its entirety selective to the sidewall spacers of the pFET device;

conformally forming a second liner above and in direct contact with the pFET device and along a vertical sidewall of a remaining portion of the fill material above the nFET device;

depositing a first inter level dielectric above the second liner;

removing the remaining portion of the fill material and a remaining portion of the first liner to expose the nFET device, the etch rate of the first liner is substantially different from an etch rate of the sidewall spacers of the nFET device, such that the remaining portion of the first liner is removed in its entirety selective to the sidewall spacers of the nFET device; and

conformally forming a third liner above and in direct contact with the nFET device and in direct contact with a vertical portion of the second liner.

2. The method of claim 1, wherein removing the portion of the fill material and the portion of the first liner to expose only the pFET device comprises:

depositing a photo resist directly above only the nFET device;

removing the portion of the fill material directly above the pFET device;

removing the portion of the first liner directly above the pFET device; and

removing the photo resist.

3. The method of claim 1, wherein removing the remaining portion of the fill material and the remaining portion of the first liner to expose the nFET device comprises:

depositing a second photo resist directly above only the pFET device;

removing a portion of the second liner directly above the nFET device;

removing the remaining portion of the fill material directly above the nFET device; and

removing the remaining portion of the first liner directly above the nFET device.

4. The method of claim 1, wherein a distance between the pFET source drain region and the pFET dummy gate is substantially equal to a distance between the nFET source drain region and the nFET dummy gate.

5. The method of claim 1, further comprising:

growing an epitaxy in the source drain regions of the pFET device; and

growing a second epitaxy in the source drain regions of the nFET device.

6. The method of claim 1, wherein a width or lateral thickness of the sidewall spacers of the pFET device are substantially equal to a second width or lateral thickness of the sidewall spacers of the nFET device.

7. The method of claim 1, wherein the first liner comprises silicon oxide and the fill material comprises amorphous silicon.

8. The method of claim 1, wherein the first liner comprises a metal and the fill material comprises a dielectric material.

9. A method comprising:

forming a p-type field effect transistor (pFET device) and an n-type field effect transistor (nFET device) each having sidewall spacers on opposite sidewalls of a dummy gate;

conformally forming a first liner on the nFET device and depositing a fill material directly on the first liner of the nFET device;

protecting the nFET device while growing an epitaxy in a source drain region of the pFET device;

conformally forming a second liner above and in direct contact with the pFET device, including the epitaxy in the source drain regions of the pFET device, and along a vertical sidewall of a remaining portion of the fill material above the nFET device;

depositing a first inter level dielectric above the second liner; and

protecting the pFET device and the first inter level dielectric while growing a second epitaxy in a source drain region of the nFET device.

10. The method of claim 9, wherein protecting the nFET device while growing an epitaxy in the source drain region of the pFET device comprises:

depositing a photo resist directly above only the nFET device;

removing a portion of the fill material directly above the pFET device;

removing a portion of the first liner directly above the pFET device;

removing the photo resist; and

growing the epitaxy in a source drain region of the pFET device.

11. The method of claim 9, wherein protecting the pFET device and the first inter level dielectric while growing a second epitaxy in the source drain region of the nFET device comprises:

depositing a second photo resist directly above only the pFET device;

removing a portion of the second liner directly above the nFET device;

removing a remainder of the fill material directly above the nFET device;

removing a remainder of the first liner directly above the nFET device;

removing the second photo resist; and

growing the second epitaxy in a source drain region of the nFET device.

12. The method of claim 9, wherein a distance between the pFET source drain region and pFET the dummy gate is substantially equal to a distance between the nFET source drain region and the nFET dummy gate.

13. The method of claim 9, wherein a width or lateral thickness of the sidewall spacers of the pFET device are substantially equal to a width or lateral thickness of the sidewall spacers of the nFET device.

14. The method of claim 9, wherein the first liner comprises silicon oxide and the fill material comprises amorphous silicon.

15. The method of claim 9, wherein the first liner comprises a metal and the fill material comprises a dielectric material.