Semiconductor module

• US 9,331,001 B2
• Filed: 09/02/2010
• Issued: 05/03/2016
• Est. Priority Date: 09/02/2010
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Kadoguchi, Takuya, Suzuki, Yoshikazu, Kaji, Masaya, Nakajima, Kiyofumi, Miyoshi, Tatsuya, Kawashima, Takanori, Okumura, Tomomi
• Primary Examiner(s): Reames, Matthew
• Assistant Examiner(s): Wall, Vincent
• Application Number:
  US13/819,209
• Publication Number:
  US 20130154084A1
• Time in Patent Office: 2,070 Days
• Field of Search: 257/717, 257/714, 257/723, 257/712, 257/731, 257/732, 257/733
• US Class Current: 1/1
• CPC Class Codes: G01N 2291/044 Internal reflections (echoes), e.g. on walls or defects
• CPC Class Codes: G01N 2291/2697 Wafer or (micro)electronic parts
• CPC Class Codes: G01N 29/07 by measuring propagation velocity or propagation time of acoustic waves
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/371 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/40225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 24/36 : Structure, shape, material or disposition of the strap connectors prior to the connecting process
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/84 : using a strap connector
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

Claims

1. A semiconductor module comprising:

a semiconductor device;

a metal plate portion that includes a first surface on a side of the semiconductor device;

a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion;

a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion;

a heat sink part that is provided between the semiconductor device and the first surface of the metal plate portion on the side of the semiconductor device; and

an insulating material that is provided between the heat sink part and the first surface of the metal plate portion on the side of the semiconductor device;

the heat sink part and the insulating material are disposed in the molded portion

the insulating material includes an end that extends outwardly with respect to an end of the heat sink part, and

the fins of the metal plate portion are formed at a center side with respect to the end of the heat sink part,

wherein the metal plate portion includes fastening portions provided at opposite ends thereof in a first direction,

the fastening portions of the metal plate portion are formed to have a thickness smaller than a center portion of the metal plate portion, and

the fastening portion of one end of the metal plate portion in the first direction is coplanar with the first surface of the metal plate portion on the side of the semiconductor device, and the fastening portion of another end of the metal plate portion in the first direction is coplanar with a second surface of the metal plate portion on the side of the cooling plate portion.