Magnetically coupled galvanically isolated communication using lead frame
First Claim
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1. An integrated circuit package, comprising:
- an encapsulation; and
a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including;
a first conductor forming a first conductive loop;
a second conductor galvanically isolated from the first conductor, wherein the second conductor forms a second conductive loop proximate to and magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors, wherein a signal transmitted from a transmit circuit coupled to the first conductor is received through the magnetic communication link by a receive circuit coupled to the second conductor; and
a first bond wire disposed within the encapsulation and coupling together portions of the first conductive loop.
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Abstract
An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within the encapsulation. The lead frame includes a first conductor forming a first conductive loop. A second conductor is galvanically isolated from the first conductor. The second conductor forms a second conductive loop proximate to and magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors. A signal that is transmitted from a transmit circuit coupled to the first conductor is coupled to be received through the magnetic communication link by a receive circuit coupled to the second conductor.
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Citations
15 Claims
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1. An integrated circuit package, comprising:
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an encapsulation; and a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including; a first conductor forming a first conductive loop; a second conductor galvanically isolated from the first conductor, wherein the second conductor forms a second conductive loop proximate to and magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors, wherein a signal transmitted from a transmit circuit coupled to the first conductor is received through the magnetic communication link by a receive circuit coupled to the second conductor; and a first bond wire disposed within the encapsulation and coupling together portions of the first conductive loop. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification