Method and system for improving crosstalk attenuation within a plug/jack connection and between nearby plug/jack combinations

• US 9,331,431 B2
• Filed: 03/13/2015
• Issued: 05/03/2016
• Est. Priority Date: 12/02/2008
• Status: Active Grant

• Current Assignee: Panduit Corporation
• Original Assignee: Panduit Corporation
• Inventors: Straka, Frank M., Tellas, Ronald A., German, Jason J., Vaitkus, Vytas J.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US14/657,399
• Publication Number:
  US 20150188260A1
• Time in Patent Office: 417 Days
• Field of Search: 439/676, 439/941, 439/607.38, 439/607.4
• US Class Current: 1/1
• CPC Class Codes: H01R 13/516 Means for holding or embracing insulating body, e.g. casing , hoods
• CPC Class Codes: H01R 13/518 for holding or embracing several coupling parts, e.g. frames
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6473 Impedance matching
• CPC Class Codes: H01R 13/6476 by making an aperture, e.g. a hole
• CPC Class Codes: H01R 13/658 High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse] coaxial coupling devices specially adapted for high frequency H01R24/40; for flat or ribbon cable connectors H01R12/774; for coaxial cable H01R9/05
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: Y10S 439/941 Crosstalk suppression

Abstract

An RJ45 Communication jack has a housing with a top, bottom, front, and back. A foil is immediately adhered to and partially covers the housing. A top or bottom of the housing is covered by a first portion and a second portion of the foil wherein the first portion and the second portion are separated by a nonconductive gap. The gap extends from the front of the housing to the rear of the housing.

Claims

1. A jack for improving crosstalk attenuation, comprising:

a housing;

a metallized surface at least partially covering the housing;

a printed circuit board contained within the housing;

first and second insulation displacement contacts, the first insulation displacement contact being located closer to the metallized surface than the second insulation displacement contact, the first and second insulation displacement contacts being associated with a first differential signal; and

a first conductive trace stub electrically connected to the second insulation displacement contact routed proximate to an edge of the printed circuit board and proximate to the metallized surface, the first conductive trace stub configured to at least partially balance coupling from the first insulation displacement contact to the metallized surface with coupling from the second insulation displacement contact to the metallized surface for the first differential signal.

2. The jack for improving crosstalk attenuation of claim 1, further comprising a first via associated with the first insulation displacement contact and a second via associated with the second insulation displacement contact, the first conductive stub also configured to at least partially balance coupling from the first via to the metallized surface with coupling from the second via to the metallized surface for the first differential signal.

3. The jack for improving crosstalk attenuation of claim 2, further comprising a sled.

4. The jack for improving crosstalk attenuation of claim 3, further comprising a wire cap.

5. The jack for improving crosstalk attenuation of claim 4, further comprising plug interface contacts.

6. The jack for improving crosstalk attenuation of claim 1, further comprising signal traces on the printed circuit board associated with the first differential signal, a portion of the traces being located close to an edge of the printed circuit board and proximate to the metallized surface in order to aid in balancing coupling from the first insulation displacement contact to the metallized surface with coupling from the second insulation contact to the metallized surface for the first differential signal.

7. The jack for improving crosstalk attenuation of claim 2, further comprising signal traces on e printed circuit board associated with the first differential signal, a portion of the traces being located close to an edge of the printed circuit board proximate to the metallized surface in order to aid in balancing coupling from the first insulation displacement contact and first via to the metallized surface with coupling from the second insulation and second via contact to the metallized surface for the first differential signal.

8. The jack for improving crosstalk attenuation of claim 1, further comprising:

third and fourth insulation displacement contacts, the third and fourth insulation displacement contacts being associated with a second differential signal, the third insulation displacement contact being closer to the metallized surface than the fourth displacement insulation contact; and

a second conductive trace stub, the second conductive stub being routed proximate to an edge of the printed circuit board and proximate to the metallized surface, and further configured to at least partially balance the coupling from the third insulation displacement contact to the metallized surface with the coupling from the fourth insulation displacement contact to the metallized surface for the second differential signal.

9. The jack for improving crosstalk attenuation of claim 8, further comprising a third via associated with the third insulation displacement contact and a fourth via associated with the fourth insulation displacement contact, the conductive stub also configured to at least partially balance the coupling from the third via to the metallized surface with the coupling from the fourth via to the metallized surface for the second differential signal.

10. The jack for improving crosstalk attenuation of claim 8, further comprising a sled.

11. The jack for improving crosstalk attenuation of claim 10, further comprising a wire cap.

12. The jack for improving crosstalk attenuation of claim 11, further comprising plug interface contacts.

13. The jack for improving crosstalk attenuation of claim 8, further comprising signal traces on the printed circuit board associated with the second differential signal, a portion of the traces being located close to an edge of the printed circuit board proximate to the metallized surface in order to aid in balancing coupling from the third insulation contact to the metallized surface with coupling from the fourth insulation contact and the metallized surface.

14. The jack for improving crosstalk attenuation of claim 9, further comprising signal traces on the printed circuit board associated with the second differential signal pair, a portion of the traces being located close to an edge of the printed circuit board proximate to the metallized surface in order to aid in balancing coupling from the third insulation contact and third via to the metallized surface with coupling from the fourth insulation contact and fourth via to the metallized surface.