Molded semiconductor package with snap lid

• US 9,332,164 B2
• Filed: 03/15/2013
• Issued: 05/03/2016
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): Vieaux, Gary C
• Application Number:
  US13/837,283
• Publication Number:
  US 20130265486A1
• Time in Patent Office: 1,145 Days
• Field of Search: 348/340
• US Class Current: 1/1
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1. A package comprising:

a substrate comprising a top substrate surface and a bottom substrate surface;

a semiconductor die coupled to the top substrate surface, where said semiconductor die comprises an active area that is responsive to light;

a molding attached to said substrate, said molding comprising an attachment feature shaped to receive an extension of a lid, the attachment feature comprising a first attachment surface that is parallel to the top substrate surface; and

said lid attached over at least a portion of said molding and comprising the extension received by the attachment feature of said molding, the extension comprising a first extension surface that is parallel to and in contact with the first attachment surface,

where each of said molding and said lid comprises an aperture through which light can pass,

wherein the extension of said lid extends from a side surface of said lid, and said lid comprises a top surface that faces away from said semiconductor die and said substrate, wherein the top surface of said lid comprises alignment features, and

wherein the alignment features of said lid are indentations that do not penetrate said lid.

2. The package of claim 1, wherein the attachment feature of said molding is located on an outer surface of said molding.

3. The package of claim 2, wherein the attachment feature of said molding is located on an outer side surface of said molding.

4. The package of claim 3, wherein the attachment feature of said molding comprises an inlet in the outer side surface of said molding.

5. The package of claim 2, wherein the attachment feature of said molding extends around an entire outside perimeter of said molding.

6. The package of claim 1, wherein the attachment feature of said molding comprises an indentation in a side surface of said molding into which the lid extension slides.

7. The package of claim 6, wherein the attachment feature of said molding comprises an indentation in a side surface of said molding into which the lid extension slides in a direction orthogonal to the side surface of said molding.

8. The package of claim 1, wherein the extension of said lid comprises a second extension surface that is flat and adjacent to the first extension surface, and where the first and second extension surfaces meet at an oblique angle.

9. The package of claim 8, wherein said attachment feature of said molding comprises a second attachment surface that is flat and parallel to and in contact with the second extension surface.

10. The package of claim 1, wherein the aperture of said lid extends completely through said lid.

11. The package of claim 1, wherein the indentations are located at a perimeter edge of the top surface of said lid.

12. The package of claim 1, wherein interaction between the lid extension and the attachment feature of said molding restricts movement between the lid and the molding at least in a direction along a focal axis of the semiconductor die.

13. The package of claim 1, wherein interaction between the lid extension and the attachment feature of said molding restricts movement between the lid and the molding at least in a direction orthogonal to a focal axis of the semiconductor die.

14. The package of claim 1, wherein said lid is molded.

15. The package of claim 1, wherein said molding is attached to said substrate with adhesive.

16. A package comprising:

a substrate comprising a top substrate surface and a bottom substrate surface;

a semiconductor die coupled to the top substrate surface, where said semiconductor die comprises an active area that is responsive to light;

a molding attached to said substrate, said molding comprising an attachment feature shaped to receive an extension of a lid, the attachment feature comprising a first attachment surface that is parallel to the top substrate surface; and

said lid being attached over at least a portion of said molding and comprising the extension received by the attachment feature of said molding, the extension comprising a first extension surface that is parallel to and in contact with the first attachment surface,

where each of said molding and said lid comprises an aperture through which light can pass,

wherein the extension of said lid extends from a side surface of said lid, and said lid comprises a top surface that faces away from said semiconductor die and said substrate, wherein the top surface of said lid comprises alignment features,

and further comprising a lens, and wherein the alignment features of said lid align said lens to said semiconductor die.

17. A package comprising:

a substrate comprising a top substrate surface and a bottom substrate surface;

a semiconductor die coupled to the top substrate surface, where said semiconductor die comprises an active area that is responsive to light;

a molding attached to said substrate, said molding comprising an attachment feature shaped to receive an extension of a lid, the attachment feature comprising a first attachment surface that is parallel to the top substrate surface; and

said lid being attached over at least a portion of said molding and comprising the extension received by the attachment feature of said molding, the extension comprising a first extension surface that is parallel to and in contact with the first attachment surface,

where each of said molding and said lid comprises an aperture through which light can pass,

wherein the extension of said lid extends from a side surface of said lid, and said lid comprises a top surface that faces away from the semiconductor die and the substrate, wherein the top surface of said lid comprises alignment features, and

wherein the alignment features of said lid comprise a first alignment feature near a first top external surface corner of said lid and a second alignment feature near a second top external surface corner of said lid.

18. A package comprising:

a substrate;

a semiconductor die coupled to said substrate, where said semiconductor die comprises an active area that is responsive to light;

an optical element;

a lid comprising a top, multiple sides, and a pointed tab extending from at least one of the multiple sides; and

a molding attached to said substrate, said molding comprising an indentation located on the outer side of said molding and shaped to receive the pointed tab of said lid,

where said lid is attached over at least a portion of said molding, the indentation of said molding receiving the pointed tab of said lid, and

where each of said molding and said lid comprises an aperture through which light can pass, the aperture of said lid extending completely through said lid.

19. The package of claim 18, wherein said lid blocks movement of said optical element in at least one direction.

20. The package of claim 18, wherein the aperture of said lid is rectangular.