Data center module with leveling pad
First Claim
Patent Images
1. A data center, comprising:
- a computer room comprising a floor;
one or more data center modules, wherein at least one of the one or more data center modules comprises;
a module base; and
one or more rack computing systems coupled to the module base;
one or more pads between the module base of the at least one data center module and the floor; and
a plurality of pad compression mechanisms coupled to the floor;
wherein the pad is configured to compress to at least partially conform to variations in a surface of the floor;
wherein the plurality of pad compression mechanisms comprise a first pad compression mechanism coupled to the floor at a first location and a second pad compression mechanism coupled to the floor at a second location, wherein the surface of the floor at the first location is at a different elevation than the surface of the floor at the second location;
wherein the module base is configured to transmit a given compressive force exerted on the module base by the first pad compression mechanism and to transmit another compressive force exerted on the module base by the second pad compression mechanism such that the module base compresses the pad at the first location by a given amount and compresses the pad at the second location by another amount, such that a level of the at least one data center module is adjusted.
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Abstract
A system includes a floor, one or more modules, one or more pads between a base of the modules and the floor, and one or more pad compression mechanisms. The data center modules include more electrical systems coupled to the module base. The pads compress to conform to variations in the surface of the floor. The pad compression mechanisms are operable by a user to compress the pads between the modules and the floor.
40 Citations
28 Claims
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1. A data center, comprising:
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a computer room comprising a floor; one or more data center modules, wherein at least one of the one or more data center modules comprises; a module base; and one or more rack computing systems coupled to the module base; one or more pads between the module base of the at least one data center module and the floor; and a plurality of pad compression mechanisms coupled to the floor; wherein the pad is configured to compress to at least partially conform to variations in a surface of the floor; wherein the plurality of pad compression mechanisms comprise a first pad compression mechanism coupled to the floor at a first location and a second pad compression mechanism coupled to the floor at a second location, wherein the surface of the floor at the first location is at a different elevation than the surface of the floor at the second location; wherein the module base is configured to transmit a given compressive force exerted on the module base by the first pad compression mechanism and to transmit another compressive force exerted on the module base by the second pad compression mechanism such that the module base compresses the pad at the first location by a given amount and compresses the pad at the second location by another amount, such that a level of the at least one data center module is adjusted. - View Dependent Claims (2, 3, 4, 5)
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6. A system, comprising:
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one or more modules comprising; a module base; and one or more electrical systems coupled to the module base; and one or more pads between the module base of at least one of the modules and a floor, wherein at least one of the pads is configured to compress to at least partially conform to variations in a surface of the floor; and a plurality of pad compression mechanisms adjustable to compress at least one of the one or more pads between at least one of the modules and the floor wherein the plurality of pad compression mechanisms comprise a first pad compression mechanism configured to couple to the floor at a first location and a second pad compression mechanism configured to couple to the floor at a second location, wherein the surface of the floor at the first location is at a different elevation than the surface of the floor at the second location; wherein the module base of the at least one module is configured to transmit a given compressive force exerted on the module base by the first pad compression mechanism and to transmit another compressive force exerted on the module base by the second pad compression mechanism such that the module base compresses the pad at the first location by a given amount and compresses the pad at the second location by another amount, such that a level of the at least one module is adjusted. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A pad, comprising:
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a body configured to support a data center module, wherein at least a portion of the body is compressible and configured to at least partially conform to variations in the surface of a floor; and a plurality of openings configured to receive a plurality of compression mechanisms, wherein the plurality of openings comprise openings aligned in a first line and openings aligned in at least one additional line, wherein the body is configured to compress respective amounts due to respective compressive forces exerted on the body by each of at least three respective compression mechanisms of the plurality of compression mechanisms, wherein each compression mechanism of the at least three compression mechanisms is received at a respective opening of the plurality of openings, such that a level of a surface of the pad is adjustable in more than one direction. - View Dependent Claims (24, 25, 26)
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27. A method, comprising:
- placing one or more pads on a floor of a site at a data center, wherein the one or more pads are configured to compress and conform to variations in a surface of the floor;
placing a module base on the one or more pads on the floor;
placing one or more modules comprising one or more rack computing systems on the module base;
adjusting a first compression mechanism coupled to the floor to apply a compression load to the module base at a first location on at least one of the pads; and
adjusting a second compression mechanism coupled to the floor to apply a different compression load to the module base at a second location on the at least one pad, wherein the surface of the floor at the second location is at a different elevation than the surface of the floor at the first location;
wherein adjusting the first compression mechanism and adjusting the second compression mechanism compress the at least one pad at the first location by a given amount and compress the at least one pad at the second location by another amount to cause a level of at least one of the modules to be adjusted. - View Dependent Claims (28)
- placing one or more pads on a floor of a site at a data center, wherein the one or more pads are configured to compress and conform to variations in a surface of the floor;
Specification