Chip resistor
First Claim
1. A chip resistor, comprising:
- a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface;
two first electrodes, disposed on the first surface;
two second electrodes, disposed on the second surface;
a resistive layer, disposed on the first surface and covering part of the two first electrodes;
at least one protection layer, disposed on the resistive layer and covering part of the two first electrodes, and one side of the at least one protection layer comprising at least two overlay sides and at least one overlay plane, wherein the at least one overlay plane is disposed between the at least two overlay sides, and wherein the at least one protection layer is formed as a convex structure; and
at least one coating layer, covering the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes.
1 Assignment
0 Petitions
Accused Products
Abstract
The disclosure provides a chip resistor including: a substrate, two first electrodes, two second electrodes, a resistive layer, at least one protection layer and at least one coating layer. The protection layer covers part of the two first electrodes, and includes at least two overlay sides and at least one overlay plane. The coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. The chip resistor uses the two overlay sides and the overplay plane to extend a distance between the two first electrodes and the outside. Therefore, it is difficult for the airborne sulfur, sulfides and sulfur-containing compounds to enter and react with the two first electrodes. Thus, the chip resistor can resist corrosion of harmful substances such as sulfur, sulfides and sulfur-containing compounds or halogens on the electrodes.
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Citations
11 Claims
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1. A chip resistor, comprising:
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a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface; two first electrodes, disposed on the first surface; two second electrodes, disposed on the second surface; a resistive layer, disposed on the first surface and covering part of the two first electrodes; at least one protection layer, disposed on the resistive layer and covering part of the two first electrodes, and one side of the at least one protection layer comprising at least two overlay sides and at least one overlay plane, wherein the at least one overlay plane is disposed between the at least two overlay sides, and wherein the at least one protection layer is formed as a convex structure; and at least one coating layer, covering the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A chip resistor, comprising:
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a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface; two first electrodes, disposed on the first surface; two second electrodes, disposed on the second surface; a resistive layer, disposed on the first surface and covering part of the two first electrodes; at least one protection layer, disposed on the resistive layer and completely covering the other part of the two first electrodes on the plane, and the at least one protection layer comprising at least one overlay side; and at least one coating layer, covering the at least one overlay side, and the sides of the two first electrodes and the two second electrodes; wherein the at least one protection layer comprises a first protection layer and a second protection layer, the first protection layer is disposed on the resistive layer, the second protection layer is disposed on the first protection layer and completely covers the other part of the two first electrodes on the plane, the second protection layer comprises at least one overlay side and an exposed plane. - View Dependent Claims (8)
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9. A chip resistor, comprising:
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a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface; two first electrodes, disposed on the first surface; two second electrodes, disposed on the second surface; a resistive layer, disposed on the first surface and covering part of the two first electrodes; at least one protection layer, disposed on the resistive layer and completely covering the other part of the two first electrodes on the plane, and the at least one protection layer comprising at least one overlay side; and at least one coating layer, covering the at least one overlay side, and the sides of the two first electrodes and the two second electrodes, wherein the at least one protection layer comprises a first protection layer, a second protection layer and a third protection layer;
the first protection layer is disposed on the resistive layer;
the second protection layer is disposed on the first protection layer and completely covers the other part of the two first electrodes on the plane, the second protection layer comprises at least one overlay side and at least one overlay plane;
the third protection layer is disposed on the second protection layer, and the third protection layer comprises at least one overlay side. - View Dependent Claims (10, 11)
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Specification