Chip resistor

• US 9,336,931 B2
• Filed: 06/06/2014
• Issued: 05/10/2016
• Est. Priority Date: 06/06/2014
• Status: Active Grant

• Current Assignee: Yageo Corporation
• Original Assignee: Yageo Corporation
• Inventors: Tsai, Dong-Mou, Hsiao, Sheng-Li, Liu, Yung-Han, Ho, Jen-Fu, Chen, Tsai-Hu
• Primary Examiner(s): LEE, KYUNG S
• Application Number:
  US14/298,286
• Publication Number:
  US 20150357097A1
• Time in Patent Office: 704 Days
• Field of Search: 338/307, 338/309, 338/313, 338/327, 338/328, 338/332, 338/314
• US Class Current: 1/1
• CPC Class Codes: H01C 1/012 the base extending along and imparting rigidity or reinforcement to the resistive element H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00
• CPC Class Codes: H01C 1/028 the resistive element being embedded in insulation with outer enclosing sheath
• CPC Class Codes: H01C 1/142 the terminals or tapping points being coated on the resistive element
• CPC Class Codes: H01C 17/006 adapted for manufacturing resistor chips
• CPC Class Codes: H01C 7/003 Thick film resistors

Abstract

The disclosure provides a chip resistor including: a substrate, two first electrodes, two second electrodes, a resistive layer, at least one protection layer and at least one coating layer. The protection layer covers part of the two first electrodes, and includes at least two overlay sides and at least one overlay plane. The coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. The chip resistor uses the two overlay sides and the overplay plane to extend a distance between the two first electrodes and the outside. Therefore, it is difficult for the airborne sulfur, sulfides and sulfur-containing compounds to enter and react with the two first electrodes. Thus, the chip resistor can resist corrosion of harmful substances such as sulfur, sulfides and sulfur-containing compounds or halogens on the electrodes.

Claims

1. A chip resistor, comprising:

a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface;

two first electrodes, disposed on the first surface;

two second electrodes, disposed on the second surface;

a resistive layer, disposed on the first surface and covering part of the two first electrodes;

at least one protection layer, disposed on the resistive layer and covering part of the two first electrodes, and one side of the at least one protection layer comprising at least two overlay sides and at least one overlay plane, wherein the at least one overlay plane is disposed between the at least two overlay sides, and wherein the at least one protection layer is formed as a convex structure; and

at least one coating layer, covering the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes.

2. The chip resistor according to claim 1, wherein the at least one protection layer comprises a first protection layer and a second protection layer, the first protection layer is disposed on the resistive layer, and the second protection layer is disposed on the first protection layer, the second protection layer comprises at least two overlay sides and at least one overlay plane.

3. The chip resistor according to claim 2, wherein the second protection layer further comprises an exposed plane, and a thickness from the exposed plane to a bottom of the second protection layer is greater than a thickness from the overlay plane to the bottom.

4. The chip resistor according to claim 1, wherein the at least one protection layer comprises a first protection layer and a second protection layer;

the first protection layer is disposed on the resistive layer, and the first protection layer comprises at least one overlay side and at least one overlay plane;

the second protection layer is disposed on the first protection layer, and the second protection layer comprises at least one overlay side.

5. The chip resistor according to claim 4, wherein the second protection layer further comprises an exposed layer, and a thickness from the exposed plane to a bottom of the first protection layer is greater than a thickness from the overlay plane of the first protection layer to the bottom of the first protection layer.

6. The chip resistor according to claim 1, wherein the at least one coating layer comprises a first coating layer, a second coating layer and a third coating layer;

the first coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes, the second coating layer covers the first coating layer, and the third coating layer covers the second coating layer.

7. A chip resistor, comprising:

a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface;

two first electrodes, disposed on the first surface;

two second electrodes, disposed on the second surface;

a resistive layer, disposed on the first surface and covering part of the two first electrodes;

at least one protection layer, disposed on the resistive layer and completely covering the other part of the two first electrodes on the plane, and the at least one protection layer comprising at least one overlay side; and

at least one coating layer, covering the at least one overlay side, and the sides of the two first electrodes and the two second electrodes;

wherein the at least one protection layer comprises a first protection layer and a second protection layer, the first protection layer is disposed on the resistive layer, the second protection layer is disposed on the first protection layer and completely covers the other part of the two first electrodes on the plane, the second protection layer comprises at least one overlay side and an exposed plane.

8. The chip resistor according to claim 7, wherein the at least one coating layer comprises a first coating layer, a second coating layer and a third coating layer;

the first coating layer covers part of the exposed plane, the at least one overlay side, the sides of the two first electrodes, sides of the two second electrodes, and part of the two second electrodes, the second coating layer covers the first coating layer, the third coating layer covers the second coating layer.

9. A chip resistor, comprising:

a substrate, having a first surface and a second surface, and the second surface being opposite to the first surface;

two first electrodes, disposed on the first surface;

two second electrodes, disposed on the second surface;

a resistive layer, disposed on the first surface and covering part of the two first electrodes;

at least one protection layer, disposed on the resistive layer and completely covering the other part of the two first electrodes on the plane, and the at least one protection layer comprising at least one overlay side; and

at least one coating layer, covering the at least one overlay side, and the sides of the two first electrodes and the two second electrodes, wherein the at least one protection layer comprises a first protection layer, a second protection layer and a third protection layer;

the first protection layer is disposed on the resistive layer;

the second protection layer is disposed on the first protection layer and completely covers the other part of the two first electrodes on the plane, the second protection layer comprises at least one overlay side and at least one overlay plane;

the third protection layer is disposed on the second protection layer, and the third protection layer comprises at least one overlay side.

10. The chip resistor according to claim 9, wherein the at least one coating layer comprises a first coating layer, a second coating layer, and a third coating layer;

the first coating layer covers the overlay side of the third protection layer, the at least one overlay plane and the at least one overlay side of the second protection layer, sides of the two first electrodes, and the two second electrodes;

the second coating layer covers the first coating layer; and

the third coating layer covers the second coating layer.

11. The chip resistor according to claim 9, wherein the third protection layer further comprises an exposed plane, and a thickness from the exposed plane to a bottom of the second protection layer is greater than a thickness from the overlay plane of the second protection layer to the bottom of the second protection layer.