Wiring substrate and method for manufacturing the wiring substrate
First Claim
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1. A wiring substrate comprising:
- a first insulating layer;
a first magnetic layer that is a first plating film formed on the first insulating layer;
a flat coil formed on the first magnetic layer, the flat coil including a coil part having one or more coils;
a second magnetic layer that is a second plating film formed on the flat coil andan insulating part formed in a space between the one or more coils of the coil part from a plan view, the insulating part including a side surface covered by the flat coil, an upper surface of the insulating part being flush with an upper surface of the flat coil;
wherein the insulating part is formed between the one or more coils except at a periphery of one end of the coil part and a portion of a periphery of another end of the coil part from the plan view,wherein the second magnetic layer is formed directly on top of the insulating part,wherein the flat coil is a third plating film.
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Abstract
A wiring substrate includes a first insulating layer, a first magnetic layer that is a first plating film formed on the first insulating layer, a flat coil formed on the first magnetic layer, and a second magnetic layer that is a second plating film formed on the flat coil.
23 Citations
25 Claims
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1. A wiring substrate comprising:
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a first insulating layer; a first magnetic layer that is a first plating film formed on the first insulating layer; a flat coil formed on the first magnetic layer, the flat coil including a coil part having one or more coils; a second magnetic layer that is a second plating film formed on the flat coil and an insulating part formed in a space between the one or more coils of the coil part from a plan view, the insulating part including a side surface covered by the flat coil, an upper surface of the insulating part being flush with an upper surface of the flat coil; wherein the insulating part is formed between the one or more coils except at a periphery of one end of the coil part and a portion of a periphery of another end of the coil part from the plan view, wherein the second magnetic layer is formed directly on top of the insulating part, wherein the flat coil is a third plating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A wiring substrate comprising:
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a first insulating layer; a first magnetic layer that is a first plating film formed on the first insulating layer; a flat coil formed on the first magnetic layer, the flat coil including a coil part having one or more coils; a second magnetic layer that is a second plating film formed on the flat coil; a first insulating film formed between the flat coil and the first magnetic layer; and a second insulating layer formed on the second magnetic layer; a first wiring part formed on the second insulating layer; a first via that penetrates the second insulating layer and the second magnetic layer; a second insulating film formed between the second magnetic layer and the second insulating layer; and an insulating part formed in a space between the one or more coils of the coil part from a plan view, the insulating part including a side surface covered by the flat coil, an upper surface of the insulating part being flush with an upper surface of the flat coil; wherein the insulating part is formed between the one or more coils except at a periphery of one end of the coil part and a portion of a periphery of another end of the coil part from the plan view, wherein the second magnetic layer is formed directly on top of the insulating part, wherein the flat coil has one end that is connected to the first wiring part by the first via; wherein the flat coil is a third plating film. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A method for manufacturing a wiring substrate comprising the steps of:
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forming a first magnetic layer on a first insulating layer by a first plating process; forming a flat coil on the first magnetic layer, the flat coil including a coil part having one or more coils; forming an insulating part in a space between the one or more coils of the coil part from a plan view, the insulating part including a side surface covered by the flat coil, an upper surface of the insulating part being flush with an upper surface of the flat coil, and forming a second magnetic layer on the flat coil and on the insulating part by a second plating process; wherein the insulating part is formed between the one or more coils except at a periphery of one end of the coil part and a portion of a periphery of another end of the coil part from the plan view, wherein the second magnetic layer is formed directly on top of the insulating part, wherein the flat coil is a third plating film that is formed by a plating process. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification