Capacitors within an interposer coupled to supply and ground planes of a substrate

• US 9,337,138 B1
• Filed: 03/09/2012
• Issued: 05/10/2016
• Est. Priority Date: 03/09/2012
• Status: Active Grant

• Current Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Original Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Inventors: Meredith, Gregory, Wang, Yong, Abugharbieh, Khaldoon S., Wyland, Christopher P., Wu, Paul Y., Liu, Henley, Stokes, Sanjiv
• Primary Examiner(s): Tornow, Mark
• Assistant Examiner(s): Boyle, Abbigale
• Application Number:
  US13/416,640
• Time in Patent Office: 1,523 Days
• Field of Search: 257/691, 257/532, 257/E23.144, 257/E23.079, 257/E23.153, 438/599
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

An embodiment of an apparatus to reduce supply voltage noise with capacitors of an interposer of a stacked die is disclosed. In this embodiment, an interposer is coupled to a first integrated circuit die using a first plurality of interconnects. A substrate is coupled to the interposer using a second plurality of interconnects. The substrate includes a supply voltage plane and a ground plane, each of which is coupled to the first integrated circuit die using the second plurality of interconnects, the interposer, and the first plurality of interconnects. The interposer includes capacitors coupled in parallel using the supply voltage plane, the ground plane, and the second plurality of interconnects, where capacitance from capacitors of the interposer is provided to the first integrated circuit die using the supply voltage plane and the ground plane of the substrate.

Claims

1. An apparatus, comprising:

a first integrated circuit die and a second integrated circuit die;

an interposer coupled to the first integrated circuit die and the second integrated circuit die using a first plurality of interconnects, the interposer including an upper surface having at least one open space between the first integrated circuit die and the second integrated circuit die, the interposer including a lower surface having a second plurality of interconnects, the interposer including a first cross-sectional region beneath the first integrated circuit die and the second integrated circuit die and a second cross-sectional region beneath the at least one open space, the first and second cross-sectional regions being disjoint, the second cross-sectional region being devoid of any through substrate vias extending between the upper surface and the lower surface;

a substrate coupled to the interposer using the second plurality of interconnects;

wherein the substrate includes a supply voltage plane and a ground plane each of which is coupled to the first integrated circuit die using the second plurality of interconnects, the interposer, and the first plurality of interconnects;

wherein the interposer includes a plurality of capacitors entirely disposed in the second cross-sectional region, the plurality of capacitors coupled in parallel using the supply voltage plane, the ground plane, and the second plurality of interconnects; and

wherein the plurality of capacitors of the interposer provide capacitance to the first integrated circuit die using the supply voltage plane and the ground plane of the substrate.

2. The apparatus according to claim 1, wherein:

the interposer includes a supply voltage bus and a ground bus; and

the plurality of capacitors are coupled in parallel using the supply voltage bus and the ground bus.

3. The apparatus according to claim 2, wherein:

the supply voltage bus is coupled to the supply voltage plane using the second plurality of interconnects; and

the ground bus is coupled to the ground plane using the second plurality of interconnects.

4. The apparatus according to claim 3, wherein:

the supply voltage plane is coupled in parallel with the supply voltage bus; and

the ground plane is coupled in parallel with the ground bus.

5. The apparatus according to claim 3, wherein the capacitance from the plurality of capacitors of the interposer is provided to the first integrated circuit die using the supply voltage bus and the ground bus of the interposer.

6. The apparatus according to claim 5, wherein the plurality of capacitors are located sufficiently proximate to the first integrated circuit die to reduce a high-frequency voltage ripple in a supply voltage on the supply voltage bus and the supply voltage plane.

7. The apparatus according to claim 5, wherein:

the second plurality of interconnects are connected to the through-substrate vias for coupling to the supply voltage bus and the ground bus through the through-substrate vias.

8. The apparatus according to claim 7, further comprising:

a third plurality of interconnects for coupling the substrate to a printed circuit board;

wherein the supply voltage plane and the ground plane are coupled to the third plurality of interconnects.

9. The apparatus according to claim 8, wherein:

the through-substrate vias are through-silicon vias;

the first plurality of interconnects are fine pitch micro bumps;

the second plurality of interconnects are C4 bumps; and

the third plurality of interconnects are ball grid array solder balls.

10. The apparatus according to claim 9, wherein the plurality of capacitors are selected from a group consisting of trench capacitors, parallel plate capacitors, container cell capacitors, finger capacitors, and metal-insulator-metal (“

MIM”

) capacitors.

11. The apparatus according to claim 10,

wherein the first integrated circuit die has a first layout area;

and

wherein the second integrated circuit die has a second layout area smaller than the first layout area.

12. The apparatus according to claim 5, wherein the first integrated circuit die has at least one logic block associated with positioning of the plurality of capacitors.

13. The apparatus according to claim 5, wherein:

the plurality of capacitors are formed in banks of parallel capacitors; and

each of the banks of parallel capacitors is in parallel with one another.

14. An apparatus, comprising:

a first integrated circuit die including a first capacitor for providing a first capacitance;

a second integrated circuit die;

an interposer coupled to the first integrated circuit die and the second integrated circuit die using a first plurality of interconnects, the interposer including an upper surface having at least one open space between the first integrated circuit die and the second integrated circuit die, the interposer including a lower surface having a second plurality of interconnects, the interposer including a first cross-sectional region beneath the first integrated circuit die and the second integrated circuit die and a second cross-sectional region beneath the at least one open space, the first and second cross-sectional regions being disjoint, the second cross-sectional region being devoid of any through substrate vias extending between the upper surface and the lower surface;

a substrate coupled to the interposer using the second plurality of interconnects;

wherein the substrate includes a supply voltage plane and a ground plane coupled to the integrated circuit die using the second plurality of interconnects, the interposer, and the first plurality of interconnects;

wherein the interposer includes a plurality of capacitors entirely disposed in the second cross-sectional region, the plurality of capacitors coupled in parallel using the supply voltage plane, the ground plane, and the second plurality of interconnects;

wherein the substrate includes a second capacitor coupled to the supply voltage plane and the ground plane for providing a second capacitance to the integrated circuit die through the interposer; and

wherein a third capacitance from the plurality of capacitors of the interposer is provided to the integrated circuit die using the supply voltage plane and the ground plane of the substrate.

15. The apparatus according to claim 14, wherein:

the first capacitor is coupled to the supply voltage plane and the ground plane using the first plurality of interconnects; and

the first capacitance, the second capacitance and the third capacitance in combination are used to reduce a high-frequency voltage ripple in a power supply voltage of the integrated circuit die.

16. The apparatus according to claim 14, wherein the first capacitor, the second capacitor, and the plurality of capacitors are all coupled in parallel with one another.