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Hermetic wafer level packaging

  • US 9,337,168 B2
  • Filed: 02/06/2014
  • Issued: 05/10/2016
  • Est. Priority Date: 07/29/2010
  • Status: Active Grant
First Claim
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1. A method of packaging, comprising:

  • providing a first wafer, wherein the first wafer contains a plurality of transistors and an interconnect structure having a plurality of metal layers that each contain a plurality of metal lines;

    providing a second wafer, wherein the second wafer contains a micro-electrical-mechanical system (MEMS) device and a plurality of bonding pads, wherein the MEMS device includes at least one of;

    actuators, mirrors, gyroscopes, or accelerometers; and

    bonding the first wafer and the second wafer together through a metal diffusion process and in a manner such that the bonding pads of the second wafer are bonded to the interconnect structure of the first wafer.

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