Electronic devices with reflective chamfer surfaces
First Claim
1. A metal housing for an electronic device, the metal housing comprising:
- an edge defined by a first side and a second side that meet at a chamfer;
a first anodization layer positioned on the first side and the second side, thereby defining a first interface surface between the first side and the first anodization layer, and a second interface surface between the second side and the first anodization layer; and
a second anodization layer positioned on the chamfer, thereby defining a chamfer interface surface between the chamfer and the second anodization layer, wherein the chamfer interface surface has a more even topology than each of the first interface surface and the second interface surface such that the chamfer interface surface has a higher spectral reflectivity than each of the first interface surface and the second interface surface.
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Accused Products
Abstract
The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface thereon. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter is used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. The diamond cutter has a cutting edge and a land. The cutting edge cuts the surface of the part and the land burnishes the surface of the part to form a highly reflective and smooth surface. Thus, the diamond cutter cuts and burnishes portions of the part, thereby eliminating a subsequent polishing step.
72 Citations
20 Claims
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1. A metal housing for an electronic device, the metal housing comprising:
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an edge defined by a first side and a second side that meet at a chamfer; a first anodization layer positioned on the first side and the second side, thereby defining a first interface surface between the first side and the first anodization layer, and a second interface surface between the second side and the first anodization layer; and a second anodization layer positioned on the chamfer, thereby defining a chamfer interface surface between the chamfer and the second anodization layer, wherein the chamfer interface surface has a more even topology than each of the first interface surface and the second interface surface such that the chamfer interface surface has a higher spectral reflectivity than each of the first interface surface and the second interface surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A housing for an electronic device, the housing comprising:
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multiple metal portions coupled by at least one plastic connector portion, wherein at least one of the metal portions has a first side and a second side that meet at a chamfer, wherein each of the first side and the second side has a first anodized layer formed thereon, thereby defining a first interface surface between the first side and the first anodized layer, and a second interface surface between the second side and the first anodized layer, and wherein the chamfer has a second anodized layer formed thereon, thereby defining a chamfer interface surface between the chamfer and the second anodized layer, wherein the chamfer interface surface has a flatter topology than each of the first interface surface and the second interface surface such that the chamfer interface surface spectrally reflects more incident light than each of the first interface surface and the second interface surface. - View Dependent Claims (13, 14, 15, 16)
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17. A housing for a portable electronic device, the housing comprising:
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a metal portion having a back and a side wall, wherein the back and the side wall meet at a chamfer, wherein each of the back and the side wall have a first anodized layer formed thereon such that the back and the first anodized layer define a first interface surface positioned therebetween, and the side wall and the first anodized layer define a second interface surface positioned therebetween, and wherein the chamfer has a second anodized layer formed thereon such that the chamfer and the second anodized layer define a chamfer interface surface, wherein the chamfer interface surface is smoother than each of the first interface surface and the second interface surface such that the chamfer interface surface has a higher spectral reflectivity than each of the first interface surface and the second interface surface, wherein the first anodized layer is more opaque than the second anodized layer. - View Dependent Claims (18, 19, 20)
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Specification