Layered structure for use with high power light emitting diode systems

• US 9,341,355 B2
• Filed: 08/30/2013
• Issued: 05/17/2016
• Est. Priority Date: 03/06/2008
• Status: Active Grant

• Current Assignee: MetroSpec Technology LLC
• Original Assignee: MetroSpec Technology LLC
• Inventors: Crandell, Wm. Todd, Johnson, Anthony Mitchell, Schweitzer, Tony Stephen, Holec, H. Vic
• Primary Examiner(s): Kebede, Brook
• Application Number:
  US14/015,679
• Publication Number:
  US 20140168982A1
• Time in Patent Office: 991 Days
• Field of Search: 257/88, 257/98, 257/E33.054, 257/E33.055, 257/E33.059, 257/E33.069
• US Class Current: 1/1
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2311/12 Copper
• CPC Class Codes: B32B 2315/085 Glass fiber cloth or fabric
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21V 21/14 Adjustable mountings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Abstract

A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.

Claims

1. A layered structure for use with a light emitting diode system, comprising:

an electrically insulating intermediate layer disposed between a top layer and a bottom layer;

the top layer, the intermediate layer, and the bottom layer forming an at least semi-flexible elongate member having a longitudinal axis, the at least semi-flexible elongate member having sufficient flexibility to be bent along the longitudinal axis to a radius of curvature of 6 inches; and

the top layer comprising electrical circuits and a protective coating;

the top layer being pre-populated with electrical components, the electrical components including at least one light emitting diode.

2. The layered structure of claim 1, wherein the bottom layer is 0.0007 to 0.0056 inches thick.

3. The layered structure of claim 1, wherein the top layer includes 0.5 to 4.0 ounces per square foot of copper, the intermediate layer includes fiberglass 0.005 to 0.020 inch thick, and the bottom layer includes 0.5 to 4.0 ounces per square foot of copper.

4. The layered structure of claim 1, further comprising a thermally conductive adhesive layer disposed under the bottom layer.

5. The layered structure of claim 4, wherein the top, intermediate, bottom, and adhesive layers have a low thermal resistance.

6. The layered structure of claim 5, wherein the top, intermediate, bottom, and adhesive layers have a thermal resistance of less than 5 degrees Celsius per Watt.

7. The layered structure of claim 1, wherein the layered structure is wound about a hub of a reel.

8. The layered structure of claim 1, the electrical components including at least one light emitting diode greater than 0.5 Watt per 0.75 inch squared.

9. A layered structure for use with a light emitting diode system, comprising:

an electrically insulating intermediate layer interconnecting a top layer and a bottom layer, the top layer comprising an electrically conductive material and the bottom layer comprising an electrically conductive material;

the top layer, the intermediate layer, and the bottom layer forming an at least semi-flexible elongate member having a longitudinal axis, the at least semi-flexible elongate member having sufficient flexibility to be bent along the longitudinal axis to a radius of curvature of 6 inches; and

the top layer being pre-populated with electrical components, the electrical components including at least one light emitting diode.

10. The layered structure of claim 9, wherein the top layer includes 0.5 to 4.0 ounces per square foot of copper, the intermediate layer includes fiberglass 0.005 to 0.020 inch thick, and the bottom layer includes 0.5 to 4.0 ounces per square foot of copper.

11. The layered structure of claim 9, further comprising a thermally conductive adhesive layer connected to the bottom layer, the adhesive layer being configured and arranged to fill voids up to 0.002 inch.

12. The layered structure of claim 11, wherein the top, intermediate, bottom, and adhesive layers have a low thermal resistance.

13. The layered structure of claim 12, wherein the top, intermediate, bottom, and adhesive layers have a thermal resistance of less than 5 degrees Celsius per Watt.

14. The layered structure of claim 9, wherein the layered structure is wound about a hub of a reel.

15. The layered structure of claim 9, the electrical components including at least one light emitting diode greater than 0.5 Watt per 0.75 inch squared.