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Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems

  • US 9,343,369 B2
  • Filed: 05/19/2014
  • Issued: 05/17/2016
  • Est. Priority Date: 05/19/2014
  • Status: Active Grant
First Claim
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1. A three dimensional (3D) integrated circuit (IC) (3DIC), comprising:

  • a first tier comprising;

    a first holding substrate;

    a first transistor positioned above the first holding substrate; and

    a first interconnection metal layer positioned above the first transistor, wherein the first interconnection metal layer comprises a first metal bonding pad; and

    a second tier comprising;

    a second interconnection metal layer comprising a second metal bonding pad bonded to the first metal bonding pad;

    a second transistor positioned above the second interconnection metal layer, the second transistor comprising a second gate and a second gate back surface; and

    a second back gate bias positioned above and proximate the second gate back surface.

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