Magnetic contacts
First Claim
1. An apparatus comprising:
- a first integrated circuit (IC) substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, wherein the first magnet is disposed within the first electrical routing feature;
a second integrated circuit (IC); and
an interconnect structure coupled with the first electrical routing feature, the interconnect structure comprising a plurality of magnetic particles.
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Accused Products
Abstract
Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.
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Citations
21 Claims
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1. An apparatus comprising:
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a first integrated circuit (IC) substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, wherein the first magnet is disposed within the first electrical routing feature; a second integrated circuit (IC); and an interconnect structure coupled with the first electrical routing feature, the interconnect structure comprising a plurality of magnetic particles. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A system comprising:
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a circuit board; and a package assembly coupled with the circuit board, wherein the package assembly includes a first integrated circuit (IC) substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, wherein the first magnet is disposed within the first electrical routing feature; a second integrated circuit (IC) substrate; and an interconnect structure coupled with the first electrical routing feature, the interconnect structure comprising a plurality of magnetic particles. - View Dependent Claims (13, 14, 15, 16, 17)
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18. An apparatus comprising:
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a first integrated circuit (IC) substrate with a plurality of first electrical routing features and a plurality of first magnets coupled with corresponding ones of the plurality of first electrical routing features, wherein the first magnets are arranged to form a checkerboard pole orientation pattern or an alternating row pole orientation pattern; a second integrated circuit (IC) substrate; and interconnect structures coupled with the plurality of first electrical routing features, the interconnect structures with a plurality of magnetic particles. - View Dependent Claims (19, 20, 21)
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Specification