Light-emitting dies incorporating wavelength-conversion materials and related methods
First Claim
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1. A method of forming a composite frame wafer comprising (i) a frame wafer defining a plurality of apertures therethrough and (ii) a plurality of discrete semiconductor dies suspended in a cured polymeric binder within the apertures, the method comprising:
- providing a frame wafer (i) having a bottom surface, (ii) having a top surface opposite the bottom surface, (iii) having a thickness spanning the top and bottom surfaces, and (iv) defining a plurality of apertures (a) each extending fully through the thickness and (b) each having a sidewall, the top surface of the frame wafer surrounding each aperture;
disposing the frame wafer over a mold substrate;
disposing the plurality of discrete semiconductor dies on the mold substrate within the apertures, each semiconductor die having at least two spaced-apart contacts adjacent the mold substrate;
coating at least a portion of the frame wafer and the plurality of semiconductor dies with a polymeric binder;
curing the polymeric binder to form the composite frame wafer; and
separating the composite frame wafer from the mold substrate,wherein the contacts of each semiconductor die remain at least partially uncoated by the polymeric binder.
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Abstract
In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
181 Citations
21 Claims
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1. A method of forming a composite frame wafer comprising (i) a frame wafer defining a plurality of apertures therethrough and (ii) a plurality of discrete semiconductor dies suspended in a cured polymeric binder within the apertures, the method comprising:
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providing a frame wafer (i) having a bottom surface, (ii) having a top surface opposite the bottom surface, (iii) having a thickness spanning the top and bottom surfaces, and (iv) defining a plurality of apertures (a) each extending fully through the thickness and (b) each having a sidewall, the top surface of the frame wafer surrounding each aperture; disposing the frame wafer over a mold substrate; disposing the plurality of discrete semiconductor dies on the mold substrate within the apertures, each semiconductor die having at least two spaced-apart contacts adjacent the mold substrate; coating at least a portion of the frame wafer and the plurality of semiconductor dies with a polymeric binder; curing the polymeric binder to form the composite frame wafer; and separating the composite frame wafer from the mold substrate, wherein the contacts of each semiconductor die remain at least partially uncoated by the polymeric binder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification