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Integrated circuit for high-voltage device protection

  • US 9,343,465 B2
  • Filed: 08/29/2014
  • Issued: 05/17/2016
  • Est. Priority Date: 08/29/2014
  • Status: Active Grant
First Claim
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1. An integrated circuit, comprising:

  • a semiconductor substrate including a memory region and a logic region;

    a memory device arranged over the memory region, the memory device including a floating gate arranged over a channel region of the memory device; and

    a logic device arranged over the logic region, the logic device including a gate arranged over a channel region of the logic device, wherein the gate comprises a first polysilicon layer arranged below a second polysilicon layer, wherein the first polysilicon layer has a first average grain size and the second polysilicon layer has a second average grain size, wherein the first average grain size is different than the second average grain size.

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