Light emitting diode module for surface mount technology and method of manufacturing the same
First Claim
1. A light emitting diode (LED) module comprising:
- an LED unit having a stacked structure including a first semiconductor layer, an active layer, a second semiconductor layer, and a reflection pattern that are formed over a substrate, and including a mesa region exposing at least a portion of a surface of the first semiconductor layer;
a first insulating layer formed over selected portions of the stacked structure to expose the mesa region, the first insulating layer patterned on the reflection pattern to form a first pad region;
a conductive reflection layer formed over the first insulating layer and the first semiconductor layer exposed in the mesa region;
a second insulating layer formed over the conductive reflection layer, the second insulating layer patterned on the conductive reflection layer to form a second pad region;
a first pad formed over the first pad region; and
a second pad formed over the second pad region.
1 Assignment
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Accused Products
Abstract
Provided is a light emitting diode (LED) in which a side surface of a reflective metal layer has a predetermined angle, and occurrence of cracks in a conductive barrier layer formed on the reflective metal layer can be prevented. Also, an LED module using LEDs is disclosed. A reflection pattern electrically connected to a second semiconductor layer is partially exposed by patterning a first insulating layer. Accordingly, a first pad is formed through the partially opened first pad region. Also, a conductive reflection layer electrically connected to a first semiconductor layer forms a second pad region formed by patterning a second insulating layer. A second pad is formed on the second pad region.
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Citations
20 Claims
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1. A light emitting diode (LED) module comprising:
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an LED unit having a stacked structure including a first semiconductor layer, an active layer, a second semiconductor layer, and a reflection pattern that are formed over a substrate, and including a mesa region exposing at least a portion of a surface of the first semiconductor layer; a first insulating layer formed over selected portions of the stacked structure to expose the mesa region, the first insulating layer patterned on the reflection pattern to form a first pad region; a conductive reflection layer formed over the first insulating layer and the first semiconductor layer exposed in the mesa region; a second insulating layer formed over the conductive reflection layer, the second insulating layer patterned on the conductive reflection layer to form a second pad region; a first pad formed over the first pad region; and a second pad formed over the second pad region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a light emitting diode (LED) module, comprising:
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forming a stacked structure including a first semiconductor layer, an active layer, a second semiconductor layer, and a reflective pattern; forming a first insulating layer over selected portions of the stacked structure to expose portions of the reflection pattern and portions of the first semiconductor layer, wherein the exposed portions of the reflection pattern and the first insulating layer over the reflection pattern define a first pad region; forming a conductive reflection layer over the first insulating layer to electrically connect with the exposed portions of the first semiconductor layer, and expose the first pad region; forming a second insulating layer over the conductive reflection layer to expose portions of the reflection pattern and portions of the conductive reflection layer, wherein the exposed portions of the conductive reflection layer and the second insulating layer over the conductive reflection layer define a second pad region; and forming a first pad over the first pad region and forming a second pad over the second pad region. - View Dependent Claims (12, 13, 14)
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15. A light emitting diode (LED) module comprising:
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a stacked structure including a first semiconductor layer, an active layer, a second semiconductor layer, and a reflection pattern that are formed over a substrate; a first pad region formed over the reflection pattern to include a first insulation layer patterned to expose at least a portion of the reflection pattern; a conductive reflection layer formed over the stacked structure; a second pad region formed over the conductive reflection layer to include a second insulation layer patterned to expose at least a portion of the conductive reflection layer; a first pad disposed over the first pad region to electrically connect the first pad region to the second semiconductor layer; and a second pad disposed over the second pad region to electrically connect the second pad region to the first semiconductor layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification