Sealing structure, device, and method for manufacturing device
First Claim
Patent Images
1. A device comprising:
- a first substrate comprising a groove portion;
an object over the first substrate;
a second substrate over the object; and
a sealant between the first substrate and the second substrate and surrounding the object and the groove portion,wherein the groove portion is located between the object and the sealant, andwherein at least part of a surface of the groove portion is exposed.
1 Assignment
0 Petitions
Accused Products
Abstract
Provided is a device in which heat conduction from a sealant to a functional element is suppressed and whose bezel is slim. The sealing structure includes a first substrate, a second substrate whose surface over which a sealed component is provided faces the first substrate, and a frame-like sealant which seals a space between the first substrate and the second substrate with the first substrate and the second substrate. The second substrate includes a groove portion between the sealant and the sealed component. The groove portion is in a vacuum or includes a substance whose heat conductivity is lower than that of the second substrate.
-
Citations
22 Claims
-
1. A device comprising:
-
a first substrate comprising a groove portion; an object over the first substrate; a second substrate over the object; and a sealant between the first substrate and the second substrate and surrounding the object and the groove portion, wherein the groove portion is located between the object and the sealant, and wherein at least part of a surface of the groove portion is exposed. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A device comprising:
-
a first substrate comprising a first groove portion; a transistor over the first substrate; a first insulating film over the transistor; a first electrode over the first insulating film; a partition wall over the first electrode; an electroluminescent layer over the first electrode and the partition wall; a second electrode over the electroluminescent layer; a second substrate over the second electrode; a sealant between the first substrate and the second substrate and surrounding the electroluminescent layer and the first groove portion; a conductive film between the first substrate and the sealant; and a flexible printed circuit electrically connected to the conductive film, wherein the first groove portion is located between the electroluminescent layer and the sealant. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A method for manufacturing a device, the method comprising the steps of:
-
forming a groove portion on a surface of a first substrate; forming an object over the surface of the first substrate; forming a precursor of a sealant over a second substrate; after forming the groove portion, the object, and the precursor of the sealant, attaching the first substrate and the second substrate to each other so that the precursor of the sealant is located between the first substrate and the second substrate; and forming the sealant by heating the precursor of the sealant, wherein the sealant surrounds the object and the groove portion, wherein the groove portion is located between the object and the sealant, and wherein at least part of a surface of the groove portion is exposed. - View Dependent Claims (19, 20, 21, 22)
-
Specification