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Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

  • US 9,345,135 B2
  • Filed: 08/07/2014
  • Issued: 05/17/2016
  • Est. Priority Date: 03/10/2009
  • Status: Active Grant
First Claim
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1. An electronic device, comprising:

  • a first substrate comprising;

    circuitry components within the first substrate, a distance between centers of at least some adjacent circuitry components of the circuitry components being a nanoscale distance;

    a microscale bond pad on a surface of the first substrate; and

    a via electrically connecting the microscale bond pad to one of the circuitry components; and

    a second substrate electrically connected to the microscale bond pad.

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