Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
First Claim
1. An electronic device, comprising:
- a first substrate comprising;
circuitry components within the first substrate, a distance between centers of at least some adjacent circuitry components of the circuitry components being a nanoscale distance;
a microscale bond pad on a surface of the first substrate; and
a via electrically connecting the microscale bond pad to one of the circuitry components; and
a second substrate electrically connected to the microscale bond pad.
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Accused Products
Abstract
Electronic devices may include a first substrate including circuitry components within the substrate, a microscale bond pad on a surface of the substrate, and a via electrically connecting the microscale bond pad to one of the circuitry components. A distance between centers of at least some adjacent circuitry components of the circuitry components may be a nanoscale distance. A second substrate may be electrically connected to the microscale bond pad. Methods of forming electronic devices may involve positioning a first substrate adjacent to a second substrate and electrically connecting the second substrate to a microscale bond pad on a surface of the first substrate. The first substrate may include circuitry components within the first substrate and a via electrically connecting the microscale bond pad to one of the circuitry components. A distance between centers of at least some adjacent circuitry components of the circuitry components may be a nanoscale distance.
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Citations
20 Claims
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1. An electronic device, comprising:
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a first substrate comprising; circuitry components within the first substrate, a distance between centers of at least some adjacent circuitry components of the circuitry components being a nanoscale distance; a microscale bond pad on a surface of the first substrate; and a via electrically connecting the microscale bond pad to one of the circuitry components; and a second substrate electrically connected to the microscale bond pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of forming an electronic device, comprising:
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positioning a first substrate adjacent to a second substrate, the first substrate comprising circuitry components within the first substrate, a distance between centers of at least some adjacent circuitry components of the circuitry components being a nanoscale distance; a microscale bond pad on a surface of the first substrate; and a via electrically connecting the microscale bond pad to one of the circuitry components; and electrically connecting the second substrate to the microscale bond pad. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification