Liquid-cooled heat sink assemblies
First Claim
1. An apparatus comprising:
- a liquid-cooled heat sink assembly including;
a thermally conductive base structure having a sidewall surface and a main heat transfer surface, the main heat transfer surface to couple to at least one component to be cooled; and
a manifold structure attached to the thermally conductive base structure, with the sidewall surface of the thermally conductive base structure residing at least partially within a recess in the manifold structure, the manifold structure and the thermally conductive base structure together defining a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the thermally conductive base structure, and wherein at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure comprises a continuous groove; and
a sealing member disposed, at least in part, within the continuous groove, the sealing member providing a fluid-tight seal between the thermally conductive base structure and the manifold structure.
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Accused Products
Abstract
Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.
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Citations
18 Claims
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1. An apparatus comprising:
a liquid-cooled heat sink assembly including; a thermally conductive base structure having a sidewall surface and a main heat transfer surface, the main heat transfer surface to couple to at least one component to be cooled; and a manifold structure attached to the thermally conductive base structure, with the sidewall surface of the thermally conductive base structure residing at least partially within a recess in the manifold structure, the manifold structure and the thermally conductive base structure together defining a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the thermally conductive base structure, and wherein at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure comprises a continuous groove; and a sealing member disposed, at least in part, within the continuous groove, the sealing member providing a fluid-tight seal between the thermally conductive base structure and the manifold structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus comprising:
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at least one electronic component to be cooled; and a liquid-cooled heat sink assembly coupled to the at least one electronic component to facilitate cooling thereof, the liquid-cooled heat sink assembly including; a thermally conductive base structure having a sidewall surface and a main heat transfer surface, the main heat transfer surface being coupled to the at least one electronic component; a manifold structure attached to the thermally conductive base structure, with the thermally conductive base structure residing at least partially within a recess in the manifold structure, the manifold structure and the thermally conductive base structure together defining a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the thermally conductive base structure, and wherein at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure comprises a continuous groove; and a sealing member disposed, at least in part, within the continuous groove, the sealing member providing a fluid-tight seal between the thermally conductive base structure and the manifold structure. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification