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Liquid-cooled heat sink assemblies

  • US 9,345,169 B1
  • Filed: 11/18/2014
  • Issued: 05/17/2016
  • Est. Priority Date: 11/18/2014
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a liquid-cooled heat sink assembly including;

    a thermally conductive base structure having a sidewall surface and a main heat transfer surface, the main heat transfer surface to couple to at least one component to be cooled; and

    a manifold structure attached to the thermally conductive base structure, with the sidewall surface of the thermally conductive base structure residing at least partially within a recess in the manifold structure, the manifold structure and the thermally conductive base structure together defining a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the thermally conductive base structure, and wherein at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure comprises a continuous groove; and

    a sealing member disposed, at least in part, within the continuous groove, the sealing member providing a fluid-tight seal between the thermally conductive base structure and the manifold structure.

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