Multi-layer covering for control modules of electrical implantable medical devices and methods of making and using

• US 9,345,897 B2
• Filed: 02/13/2015
• Issued: 05/24/2016
• Est. Priority Date: 02/21/2014
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Dorman, David M., Hahn, Benjamin Philip
• Primary Examiner(s): Wieland, Robert N
• Application Number:
  US14/622,264
• Publication Number:
  US 20150238770A1
• Time in Patent Office: 466 Days
• US Class Current: 1/1
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing

Abstract

A control module for an electrical stimulation system includes an electronic subassembly and a connector assembly coupled to the electronic subassembly. The connector assembly defines a port suitable for receiving a proximal end portion of an electrical stimulation lead. The connector assembly includes connector contacts coupled to the electronic subassembly and open to the port. The connector contacts are suitable for coupling to terminals disposed along the proximal end portion of the electrical stimulation lead when the electrical stimulation lead is received by the port. A covering is conformably disposed over the electronic subassembly and the connector assembly. The covering has an inner surface, an outer surface, and multiple layers.

Claims

1. A control module for an electrical stimulation system, the control module comprising:

an electronic subassembly;

a connector assembly coupled to the electronic subassembly, the connector assembly defining a port configured and arranged for receiving a proximal end portion of an electrical stimulation lead, the connector assembly comprising a plurality of connector contacts coupled to the electronic subassembly and open to the port, the plurality of connector contacts configured and arranged to couple to a plurality of terminals disposed along the proximal end portion of the electrical stimulation lead when the electrical stimulation lead is received by the port; and

a covering conformably disposed over the electronic subassembly and the connector assembly, the covering having an inner surface, an outer surface, and a plurality of layers, wherein at least one of the plurality of layers is a polymer layer and at least another one of the plurality of layers is a radiopaque layer, and wherein the radiopaque layer is disposed beneath the polymer layer.

2. The control module of claim 1, wherein the connector assembly further comprises a plurality of connector conductors coupled to the plurality of connector contacts, the plurality of connector conductors coupled directly to the electronic subassembly.

3. The control module of claim 1, further comprising a power source disposed in the control module and coupled to the electronic subassembly, wherein the covering is disposed over the power source.

4. The control module of claim 1, further comprising a return electrode disposed along a portion of the outer surface of the covering, the return electrode coupled electrically to the electronic subassembly.

5. The control module of claim 1, further comprising at least one moisture barrier disposed beneath the polymer layer.

6. The control module of claim 1, further comprising a metallic coating disposed over the electronic subassembly and disposed beneath the polymer layer.

7. An implantable electrical stimulation system comprising:

the control module of claim 1; and

at least one lead configured and arranged for insertion into the connector assembly of the control module, the at least one lead comprising

at least one lead body having a distal end portion, a proximal end portion, and a longitudinal length;

a plurality of electrodes disposed along the distal end portion of the at least one lead body;

a plurality of terminals disposed along the proximal end portion of the at least one lead body; and

a plurality of conductors electrically coupling the plurality of terminals to the plurality of electrodes.

8. A method of forming a control module of an implantable medical device, the method comprising:

forming a control-module assembly by coupling a connector assembly to an electronic subassembly; and

conformably disposing a covering over the control-module assembly, the covering comprising a plurality of layers, wherein at least one of the plurality of layers is a polymer layer and at least another one of the plurality of layers is a radiopaque layer, and wherein the radiopaque layer is disposed beneath the polymer layer.

9. The method of claim 8, wherein conformably disposing a covering over the control-module assembly comprises applying a moisture barrier beneath the polymer layer.

10. The method of claim 8, wherein conformably disposing a covering over the control-module assembly comprises disposing a metallic coating beneath the polymer layer to reduce heating during exposure of the control module to RF irradiation.

11. The method of claim 8, further comprising

disposing a return electrode along an outer surface of the covering;

and

coupling the return electrode to the electronic subassembly.

12. A control module for an electrical stimulation system, the control module comprising:

an electronic subassembly;

a connector assembly coupled to the electronic subassembly, the connector assembly defining a port configured and arranged for receiving a proximal end portion of an electrical stimulation lead, the connector assembly comprising a plurality of connector contacts coupled to the electronic subassembly and open to the port, the plurality of connector contacts configured and arranged to couple to a plurality of terminals disposed along the proximal end portion of the electrical stimulation lead when the electrical stimulation lead is received by the port; and

a covering conformably disposed over the electronic subassembly and the connector assembly, the covering having an inner surface, an outer surface, and a plurality of layers, wherein at least one of the plurality of layers is a polymer layer and at least another one of the plurality of layers is a metallic layer, and wherein the metallic layer is disposed beneath the polymer layer.

13. The control module of claim 12, further comprising a return electrode disposed along a portion of the outer surface of the covering, the return electrode coupled electrically to the electronic subassembly.

14. The control module of claim 12, further comprising a moisture barrier disposed beneath the polymer layer.

15. The control module of claim 12, further comprising a radiopaque coating disposed beneath the polymer layer.

16. An implantable electrical stimulation system comprising:

the control module of claim 12; and

at least one lead configured and arranged for insertion into the connector assembly of the control module, the at least one lead comprising

at least one lead body having a distal end portion, a proximal end portion, and a longitudinal length;

a plurality of electrodes disposed along the distal end portion of the at least one lead body;

a plurality of terminals disposed along the proximal end portion of the at least one lead body; and

a plurality of conductors electrically coupling the plurality of terminals to the plurality of electrodes.

17. A method of making an implantable medical device, the method comprising:

forming a control-module assembly by coupling the connector assembly of claim 12 to an electronic subassembly; and

conformably disposing a covering over the control-module assembly, the covering comprising a plurality of layers, wherein at least one of the plurality of layers is a polymer layer and at least another one of the plurality of layers is a metallic layer, and wherein the metallic. layer is disposed beneath the polymer layer.

18. The method of claim 17, wherein conformably disposing the covering over the control-module assembly includes conformably disposing a moisture barrier layer beneath the polymer layer.

19. The method of claim 17, wherein conformably disposing the covering over the control-module assembly includes conformably disposing a radiopaque layer beneath the polymer layer.