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Patterned conductive layers for sensor assembly and method of making the same

  • US 9,348,469 B2
  • Filed: 12/27/2011
  • Issued: 05/24/2016
  • Est. Priority Date: 12/28/2010
  • Status: Active Grant
First Claim
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1. A sensor assembly apparatus, comprising:

  • a transmit portion including a plurality of columns of transmit lines, each transmit line having a conductive rectangular shape in a top view; and

    a receive portion including a plurality of rows of receive lines, each receive line having a plurality of series connected conductive diamond shapes in the top view,wherein each diamond shape includes a single slot opening that is aligned with a gap between adjacent ones of the transmit lines.

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