Image sensing module and method of manufacturing the same

• US 9,349,903 B2
• Filed: 10/17/2013
• Issued: 05/24/2016
• Est. Priority Date: 08/16/2013
• Status: Active Grant

• Current Assignee: Azurewave Technologies, Inc.
• Original Assignee: Azurewave Technologies, Inc.
• Inventors: Hsu, Chi-Hsing
• Primary Examiner(s): Hagan, Christine L
• Application Number:
  US14/055,956
• Publication Number:
  US 20150048386A1
• Time in Patent Office: 950 Days
• Field of Search: 257/432
• US Class Current: 1/1
• CPC Class Codes: H01L 31/12 structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto semiconductor devices with at least one potential barrier or surface barrier adapted for light emission H01L33/00; amplifiers using electroluminescent element and photocell H03F17/00; electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element.

Claims

1. An image sensing module, comprising:

an image sensing unit including an image sensing element having an image sensing area on the top side of the image sensing element;

a light transmitting unit including a light transmitting element, wherein the light transmitting element corresponds to the image sensing area of the image sensing element;

a substrate unit including a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, wherein the flexible substrate has a through opening formed directly above the image sensing area for receiving the light transmitting unit, wherein the light transmitting unit is separately surrounded by the flexible substrate, wherein the light transmitting unit is supported above the image sensing element by a single surrounding support body which is disposed between the image sensing element and the light transmitting unit; and

a lens unit including an opaque holder disposed on the flexible substrate and the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element, wherein the opaque holder has a surrounding support leg and at least two abutting support legs directly contacting and downwardly abutting against the top surface of the light transmitting element;

wherein the image sensing area of the image sensing element is enclosed by matching the single surrounding support body and the light transmitting element for preventing the image sensing area from being polluted by external air particles;

wherein the light transmitting element is disposed inside the through opening without touching the flexible substrate; and

wherein the image sensing element, the single surrounding support body;

the light transmitting element, and the at least two abutting support legs of the opaque holder are sequentially stacked on top of one another, and the image sensing element, the electrical conductors, the flexible substrate, and the surrounding support lea of the opaque holder are sequentially stacked on top of one another.

2. The image sensing module of claim 1, wherein the image sensing element is a CMOS image sensor, the light transmitting element is a transparent glass disposed directly above the image sensing area, and the light transmitting element has an infrared filter coated layer and an antireflection layer respectively formed on the top surface and the bottom surface of the light transmitting element.

3. The image sensing module of claim 1, wherein the surrounding support leg is disposed on the flexible substrate through adhesive glue.

4. The image sensing module of claim 1, wherein the image sensing area of the image sensing element provides a first alignment base level, and the light transmitting element is disposed above the image sensing area of the image sensing element according to the first alignment base level, wherein the light transmitting element provides a second alignment base level on the top surface of the light transmitting element, and the opaque holder is disposed on the top surface of the light transmitting element to directly contact the top surface of the light transmitting element according to the second alignment base level.

5. An image sensing module, comprising:

an image sensing unit including an image sensing element having an image sensing area on the top side of the image sensing element;

a light transmitting unit including a light transmitting element, wherein the light transmitting element corresponds to the image sensing area of the image sensing element;

a substrate unit including a flexible substrate electrically connected to the image sensing element, wherein the flexible substrate has a through opening formed directly above the image sensing area for receiving the light transmitting unit, wherein the light transmitting unit is separately surrounded by the flexible substrate, wherein the light transmitting unit is supported above the image sensing element by a single surrounding support body which is disposed between the image sensing element and the light transmitting unit; and

a lens unit including an opaque holder disposed on the flexible substrate and the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element, wherein the opaque holder has a surrounding support leg disposed on the flexible substrate through adhesive glue and at least two abutting support legs directly contacting and downwardly abutting against the top surface of the light transmitting element;

wherein the image sensing area of the image sensing element is enclosed by matching the single surrounding support body and the light transmitting element for preventing the image sensing area from being polluted by external air particles;

wherein the light transmitting element is disposed inside the through opening without touching the flexible substrate;

wherein the image sensing element, the single surrounding support body, the light transmitting element, and the at least two abutting support legs of the opaque holder are sequentially stacked on top of one another, and the image sensing element, the electrical conductors, the flexible substrate, and the surrounding support leg of the opaque holder are sequentially stacked on top of one another.

6. The image sensing module of claim 5, wherein the flexible substrate is disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, the at least one through opening corresponds to the image sensing area of the image sensing element.

7. The image sensing module of claim 5, wherein the image sensing area of the image sensing element provides a first alignment base level, and the light transmitting element is disposed above the image sensing area of the image sensing element according to the first alignment base level, wherein the light transmitting element provides a second alignment base level on the top surface of the light transmitting element, and the opaque holder is disposed on the top surface of the light transmitting element to directly contact the top surface of the light transmitting element according to the second alignment base level.

8. A method of manufacturing an image sensing module, comprising:

providing an image sensing element, wherein the image sensing element has an image sensing area on the top side thereof;

providing a light transmitting element, wherein the light transmitting element corresponds to the image sensing area of the image sensing element;

providing a flexible substrate disposed on the image sensing element, wherein the flexible substrate is electrically connected to the image sensing element through a plurality of electrical conductors, the flexible substrate has a through opening formed directly above the image sensing area for receiving the light transmitting unit, wherein the light transmitting unit is separately surrounded by the flexible substrate, wherein the light transmitting unit is supported above the image sensing element by a single surrounding support body which is disposed between the image sensing element and the light transmitting unit; and

providing a lens unit disposed on the flexible substrate, wherein the lens unit includes an opaque holder disposed on the flexible substrate and the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element, and the opaque holder has a surrounding support leg and at least two abutting support legs directly contacting and downwardly abutting against the top surface of the light transmitting element;

wherein the image sensing area of the image sensing element is enclosed by matching the single surrounding support body and the light transmitting element for preventing the image sensing area from being polluted by external air particles;

wherein the light transmitting element is disposed inside the through opening without touching the flexible substrate; and

wherein the image sensing element, the single surrounding support body, the light transmitting element, and the at least two abutting support legs of the opaque holder are sequentially stacked on top of one another, and the image sensing element, the electrical conductors, the flexible substrate, and the surrounding support leg of the opaque holder are sequentially stacked on top of one another.

9. The method of claim 8, wherein the surrounding support leg is disposed on the flexible substrate through adhesive glue.

10. The method of claim 8, wherein the image sensing area of the image sensing element provides a first alignment base level, and the light transmitting element is disposed above the image sensing area of the image sensing element according to the first alignment base level, wherein the light transmitting element provides a second alignment base level on the top surface of the light transmitting element, and the opaque holder is disposed on the top surface of the light transmitting element to directly contact the top surface of the light transmitting element according to the second alignment base level.