×

Light emitter packages, systems, and methods

  • US 9,349,929 B2
  • Filed: 12/13/2012
  • Issued: 05/24/2016
  • Est. Priority Date: 05/31/2012
  • Status: Active Grant
First Claim
Patent Images

1. A light emitter package comprising:

  • a submount comprising a planar surface and at least one layer of exposed metal disposed on the planar surface of the submount;

    a plurality of light emitter chips disposed over the submount; and

    a lens disposed over the submount, the lens comprising a lens base;

    wherein the layer of exposed metal is disposed at least substantially over a portion of the planar surface that is outside of the lens base, wherein the planar surface comprises a surface area, and wherein the layer of exposed metal does not extend beyond the surface area of the submount.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×