Light emitter packages, systems, and methods

• US 9,349,929 B2
• Filed: 12/13/2012
• Issued: 05/24/2016
• Est. Priority Date: 05/31/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Clark, Joseph G., Abare, Amber C., Emerson, David T., Nevins, Jeremy S., Rosado, Raymond, Bergmann, Michael
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US13/713,410
• Publication Number:
  US 20130322070A1
• Time in Patent Office: 1,258 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 7/00 Reflectors for light sources characterised by cooling arrangements F21V29/505
• CPC Class Codes: F21Y 2105/18 annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

Claims

1. A light emitter package comprising:

a submount comprising a planar surface and at least one layer of exposed metal disposed on the planar surface of the submount;

a plurality of light emitter chips disposed over the submount; and

a lens disposed over the submount, the lens comprising a lens base;

wherein the layer of exposed metal is disposed at least substantially over a portion of the planar surface that is outside of the lens base, wherein the planar surface comprises a surface area, and wherein the layer of exposed metal does not extend beyond the surface area of the submount.

2. The light emitter package of claim 1, wherein the package delivers up to approximately 145 or more lumens per watt (LPW) at 1 W and approximately 25°

C.

3. The light emitter package of claim 1, wherein the package delivers up to approximately 180 or more lumens per watt (LPW) at 1 W and approximately 25°

C.

4. The light emitter package of claim 1, wherein the package delivers up to approximately 200 or more lumens per watt (LPW) at 1 W and approximately 25°

C.

5. The light emitter package of claim 2, wherein the plurality of light emitter chips emit light, and wherein a combined light emission from the plurality of light emitter chips is a warm white (WW) color temperature.

6. The light emitter package of claim 3, wherein the plurality of light emitter chips emit light, and wherein a combined light emission from the plurality of light emitter chips is a cool white (CW) color temperature.

7. The light emitter package of claim 4, wherein the plurality of light emitter chips emit light, and wherein a combined light emission from the plurality of light emitter chips is a cool white (CW) color temperature.

8. The light emitter package of claim 1, wherein the package delivers approximately 2050 lumens (lm) at 15 W and 25°

C. in CW temperatures.

9. The light emitter package of claim 1, wherein each chip of the plurality of chips is spaced apart from at least one other adjacent chip by at least approximately 0.06 mm or more.

10. The light emitter package of claim 1, wherein the layer of exposed metal comprises an anode and a cathode.

11. The light emitter package of claim 10, wherein a portion of reflective material is at least partially disposed between the anode and the cathode.

12. The light emitter package of claim 10, wherein a first light emitter chip is entirely disposed over the cathode.

13. The light emitter package of claim 12, wherein a second light emitter chip is wirebonded to the anode.

14. The light emitter package of claim 1, wherein an optical conversion material is disposed directly over portions of each light emitter chip.

15. The light emitter package of claim 1, wherein the exposed metal comprises copper (Cu).

16. The light emitter package of claim 1, wherein the exposed metal comprises copper (Cu), silver (Ag), and Titanium (Ti).

17. The light emitter package of claim 1, wherein the lens base comprises a circle.

18. The light emitter package of claim 17, wherein the lens base comprises a radius equal to or greater than approximately 1 mm.

19. The light emitter package of claim 17, wherein the lens base comprises a radius equal to or greater than approximately 3.25 mm.

20. The light emitter package of claim 1, wherein the submount comprises a length and a width of approximately 4 mm or more.

21. The light emitter package of claim 20, wherein the submount comprises a length and a width of approximately 7 mm.

22. The light emitter package of claim 1, wherein the light emitter chip comprises an area of at least 1.8 mm².

23. The light emitter package of claim 22, wherein the surface area comprises an area of approximately 49 mm² or more.

24. The light emitter package of claim 22, wherein the lens base comprises an area of approximately 30 mm² or more.

25. The light emitter package of claim 1, wherein the submount comprises a thermal conductivity equal to or greater than approximately 30 watts per meter kelvin (W/m·

K).

26. The light emitter package of claim 1, wherein the package is ENERGY STAR®

compliant.

27. The light emitter package of claim 1, wherein the package is UL®

recognized.