Vertical thermoelectric structures
First Claim
1. A thermoelectric device, comprising:
- a metal thermal terminal at a top end of said thermoelectric device;
a vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected at a top end to said metal thermal terminal and configured so as to conduct heat vertically from said metal thermal terminal;
a lateral thermoelectric element that includes polycrystalline silicon, configured such that a first end of said lateral thermoelectric element is thermally connected to a bottom end of said vertical thermally conductive conduit, and a second end of said lateral thermoelectric element is thermally connected to a silicon substrate; and
a region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said lateral thermoelectric element.
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Accused Products
Abstract
A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.
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Citations
20 Claims
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1. A thermoelectric device, comprising:
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a metal thermal terminal at a top end of said thermoelectric device; a vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected at a top end to said metal thermal terminal and configured so as to conduct heat vertically from said metal thermal terminal; a lateral thermoelectric element that includes polycrystalline silicon, configured such that a first end of said lateral thermoelectric element is thermally connected to a bottom end of said vertical thermally conductive conduit, and a second end of said lateral thermoelectric element is thermally connected to a silicon substrate; and a region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said lateral thermoelectric element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit, comprising:
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a first metal thermal terminal formed at a top surface of said integrated circuit; a second metal thermal terminal formed at said top surface of said integrated circuit; a first vertical thermally conductive conduit formed in said integrated circuit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected on a top end to said first metal thermal terminal and configured so as to conduct heat vertically from said first metal thermal terminal; a second vertical thermally conductive conduit formed in said integrated circuit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected on a top end to said second metal thermal terminal and configured so as to conduct heat vertically from said second metal thermal terminal; a first lateral thermoelectric element formed in said integrated circuit, configured such that a first end of said first lateral thermoelectric element is thermally connected to a bottom end of said first vertical thermally conductive conduit, and a second end of said first lateral thermoelectric element is thermally connected to a silicon substrate of said integrated circuit; a second lateral thermoelectric element formed in said integrated circuit, configured such that a first end of said second lateral thermoelectric element is thermally connected to a bottom end of said second vertical thermally conductive conduit, and a second end of said second lateral thermoelectric element is thermally connected to said silicon substrate of said integrated circuit; a first region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said first lateral thermoelectric element; a second region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said second lateral thermoelectric element; a first electrically conducting element between an electrically negative end of said first lateral thermoelectric element and an electrically positive end of said second lateral thermoelectric element; a second electrically conducting element between an electrically positive end of said first lateral thermoelectric element and a first transistor formed in said integrated circuit; and a third electrically conducting element between an electrically negative end of said second lateral thermoelectric element and a second transistor formed in said integrated circuit. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A thermoelectric device, comprising:
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a first metal thermal terminal at a top end of said thermoelectric device; a first vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected at a top end to said first metal thermal terminal and configured so as to conduct heat vertically from said first metal thermal terminal; a first lateral thermoelectric element, configured such that a first end of said first lateral thermoelectric element is thermally connected to a bottom end of said first vertical thermally conductive conduit, and a second end of said first lateral thermoelectric element is thermally connected to a silicon substrate; a first region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said first lateral thermoelectric element; a second lateral thermoelectric element, of an opposite conductivity type than said first lateral thermoelectric element, configured such that a first end of said second lateral thermoelectric element is thermally connected to a bottom end of said first vertical thermally conductive conduit, and a second end of said second lateral thermoelectric element is thermally connected to said silicon substrate; a second metal thermal terminal at said top end of said thermoelectric device; a second vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected on a top end to said second metal thermal terminal and configured so as to conduct heat vertically from said second metal thermal terminal; a third lateral thermoelectric element, of the same conductivity type as said first lateral thermoelectric element, configured such that a first end of said third lateral thermoelectric element is thermally connected to a bottom end of said second vertical thermally conductive conduit, and a second end of said third lateral thermoelectric element is thermally connected to said silicon substrate and is electrically connected to said second end of said second lateral thermoelectric element; a fourth lateral thermoelectric element, of the same conductivity type as said second lateral thermoelectric element, configured such that a first end of said fourth lateral thermoelectric element is thermally connected to said bottom end of said second vertical thermally conductive conduit, and a second end of said fourth lateral thermoelectric element is thermally connected to said silicon substrate; a second region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said second lateral thermoelectric element; a third region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said third lateral thermoelectric element; and a fourth region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said fourth lateral thermoelectric element. - View Dependent Claims (16)
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17. An integrated circuit including a thermoelectric device, comprising:
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a metal thermal terminal at a top end of said thermoelectric device; a vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected at a top end to said metal thermal terminal and configured so as to conduct heat vertically from said metal thermal terminal; a lateral thermoelectric element, configured such that a first end of said lateral thermoelectric element is thermally connected to a bottom end of said vertical thermally conductive conduit, and a second end of said lateral thermoelectric element is thermally connected to a silicon substrate; a region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said lateral thermoelectric element; and an electrically insulating layer less than 20 nanometers thick formed in said vertical thermally conductive conduit such that a first subset of said horizontal metal interconnect elements and vertical metal interconnect elements is electrically isolated from remaining said horizontal metal interconnect elements and vertical metal interconnect elements.
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18. An integrated circuit including a thermoelectric device, comprising:
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a metal thermal terminal at a top end of said thermoelectric device; a vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected at a top end to said metal thermal terminal and configured so as to conduct heat vertically from said metal thermal terminal; a lateral thermoelectric element, configured such that a first end of said lateral thermoelectric element is thermally connected to a bottom end of said vertical thermally conductive conduit, and a second end of said lateral thermoelectric element is thermally connected to a p-type silicon substrate; a region of silicon dioxide thicker than 250 nanometers formed in said p-type silicon substrate under said lateral thermoelectric element; and an n-type isolation well, formed in said p-type silicon substrate under said second end of said lateral thermoelectric element, and electrically connected to said second end of said lateral thermoelectric element.
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19. An integrated circuit including a thermoelectric device, comprising:
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a metal thermal terminal at a top end of said thermoelectric device; a vertical thermally conductive conduit, further comprising horizontal metal interconnect elements and vertical metal interconnect elements, which is thermally connected at a top end to said metal thermal terminal and configured so as to conduct heat vertically from said metal thermal terminal; a lateral thermoelectric element, configured such that a first end of said lateral thermoelectric element is thermally connected to a bottom end of said vertical thermally conductive conduit, and a second end of said lateral thermoelectric element is thermally connected to a silicon substrate; a region of silicon dioxide thicker than 250 nanometers formed in said silicon substrate under said lateral thermoelectric element; and a dielectric layer less than 20 nanometers thick formed on a top surface of said silicon substrate, such that said second end of said lateral thermoelectric element contacts a top surface of said dielectric layer. - View Dependent Claims (20)
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Specification