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Selective metalization of electrical connector or socket housing

  • US 9,350,093 B2
  • Filed: 05/07/2014
  • Issued: 05/24/2016
  • Est. Priority Date: 06/03/2010
  • Status: Active Grant
First Claim
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1. An electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB, the electrical interconnect comprising:

  • a multi-layered substrate with first and second major surfaces comprising a first dielectric layer with a plurality of first openings with first dielectric surfaces having first cross-sections, and a second dielectric layer with a plurality of second openings with second dielectric surfaces having second cross-sections, the multi-layered substrate comprising a plurality of center openings with center dielectric surfaces connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections;

    a metalizing layer formed on at least one of the first dielectric surface, the second dielectric surface, or the center dielectric surface;

    a plurality of contact members located in the center openings, the contact members comprising first contact tips located in the first opening, second contact tips located in the second openings, and center portions located in the center openings, the center portions of the contact members comprise a shape adapted to bias the first and second contact tips toward the first and second major surfaces of the multi-layered substrate, respectively; and

    a dielectric material located on at least a portion of the metalizing layer to insulate the contact members from the metalizing layer.

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