Selective metalization of electrical connector or socket housing
First Claim
1. An electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB, the electrical interconnect comprising:
- a multi-layered substrate with first and second major surfaces comprising a first dielectric layer with a plurality of first openings with first dielectric surfaces having first cross-sections, and a second dielectric layer with a plurality of second openings with second dielectric surfaces having second cross-sections, the multi-layered substrate comprising a plurality of center openings with center dielectric surfaces connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections;
a metalizing layer formed on at least one of the first dielectric surface, the second dielectric surface, or the center dielectric surface;
a plurality of contact members located in the center openings, the contact members comprising first contact tips located in the first opening, second contact tips located in the second openings, and center portions located in the center openings, the center portions of the contact members comprise a shape adapted to bias the first and second contact tips toward the first and second major surfaces of the multi-layered substrate, respectively; and
a dielectric material located on at least a portion of the metalizing layer to insulate the contact members from the metalizing layer.
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Accused Products
Abstract
A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB, including a multi-layered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively. A dielectric material different from the material of the substrate is located in at least one of the first opening, the second opening, or the center opening.
409 Citations
20 Claims
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1. An electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB, the electrical interconnect comprising:
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a multi-layered substrate with first and second major surfaces comprising a first dielectric layer with a plurality of first openings with first dielectric surfaces having first cross-sections, and a second dielectric layer with a plurality of second openings with second dielectric surfaces having second cross-sections, the multi-layered substrate comprising a plurality of center openings with center dielectric surfaces connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections; a metalizing layer formed on at least one of the first dielectric surface, the second dielectric surface, or the center dielectric surface; a plurality of contact members located in the center openings, the contact members comprising first contact tips located in the first opening, second contact tips located in the second openings, and center portions located in the center openings, the center portions of the contact members comprise a shape adapted to bias the first and second contact tips toward the first and second major surfaces of the multi-layered substrate, respectively; and a dielectric material located on at least a portion of the metalizing layer to insulate the contact members from the metalizing layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making an electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB, the method comprising the steps of:
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forming a multi-layered substrate with first and second major surfaces comprising a first dielectric layer comprising a plurality of first openings with first dielectric surfaces having first cross-sections and a second dielectric layer comprising a plurality of second openings with second dielectric surfaces having second cross-sections; forming in the multi-layered substrate a plurality of center openings with center dielectric surfaces connecting the first and second openings, the center openings comprising at least one cross-section greater than the first and second cross-sections; metalizing at least one of the first dielectric surface, the second dielectric surface, or the center dielectric surface; locating a contact members in a plurality of the center openings so first contact tips of the contact members located in the first opening, second contact tips located in the second openings, and center portions located in the center openings bias the first and second contact tips toward the first and second major surfaces of the multi-layered substrate, respectively; and forming a dielectric material on at least a portion of the metalizing layer to insulate the contact members from the metalizing layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification