High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly

• US 9,350,124 B2
• Filed: 03/13/2013
• Issued: 05/24/2016
• Est. Priority Date: 12/01/2010
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): HARVEY, JAMES R
• Application Number:
  US14/408,039
• Publication Number:
  US 20150136467A1
• Time in Patent Office: 1,168 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01R 12/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures printed connections to, or between, printed circuits H05K1/11
• CPC Class Codes: H01R 12/73 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/82 connected with low or zero insertion force
• CPC Class Codes: H01R 13/2457 consisting of at least two resilient arms contacting the same counterpart
• CPC Class Codes: H01R 13/2485 for contacting a ball
• CPC Class Codes: H01R 31/06 Intermediate parts for linking two coupling parts, e.g. adapter with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/048 : Second PCB mounted on first PCB by inserting in window or holes of the first PCB
• CPC Class Codes: H05K 2201/09381 : Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component notches in edge pads H05K2201/09181
• CPC Class Codes: H05K 2201/09545 : Plated through-holes or blind vias without lands
• CPC Class Codes: H05K 2201/09563 : Metal filled via plated through-hole filled with insulating material H05K2201/0959
• CPC Class Codes: H05K 2201/09854 : Hole or via having special cross-section, e.g. elliptical
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10386 : Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/2072 : Anchoring, i.e. one structure gripping into another providing micro- or nanometer scale roughness on a metal surface H05K2203/0307
• CPC Class Codes: H05K 2201/209 : Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 2203/1476 : Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/0094 : Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/10 : in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/1291 : Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/363 : by soldering
• CPC Class Codes: H05K 3/365 : by abutting, i.e. without alloying process
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 3/425 : characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
• CPC Class Codes: H05K 3/4694 : Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density H05K3/4691 takes precedence
• CPC Class Codes: H05K 7/1076 : co-operating by sliding
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

Claims

1. A circuit assembly comprising:

an array of integral terminals plated on a first circuit member comprising an electro-lessly plated shell with an electro-plated core. the integral terminals including at least one undercut;

a printed circuit board with a plurality of recesses configured to receive the integral terminals; and

a plurality of contact members electrically coupled with circuitry on a major surface of the printed circuit board and extending into a recesses generally parallel to the major surface;

wherein insertion of the integral terminals on the first circuit member into the recesses on the PCB is a zero or low insertion force process, such that shifting the first circuit member relative to the printed circuit board generally parallel to the major surface electrically couples the contact members with the undercuts on the integral terminals.

2. The circuit assembly of claim 1 wherein the integral terminal comprise a non-cylindrical shape.

3. The circuit assembly of claim 1 wherein the integral terminals comprise a plurality of discrete contact surfaces configured to electrically couple with the contact members on the PCB.

4. The circuit assembly of claim 1 wherein the recesses comprise exposed portions with cross-sectional shapes greater than cross-sectional shapes of the contact members.

5. The circuit assembly of claim 1 wherein the integral terminals comprise a narrow portions and the contact members comprise arms that mechanically couple with the narrow portions on the integral terminals.

6. The circuit assembly of claim 1 wherein the integral terminals comprise a narrow portions and the contact members comprise curvilinear arms that flex to receive the narrow portions on the integral terminals.

7. The circuit assembly of claim 1 wherein the contact members, comprise arms that extend around at least 150 degrees of the integral terminals.

8. The circuit assembly of claim 1 wherein the contact members comprise arms that contact at least two sides of the integral terminals.

9. The circuit assembly of claim 1 wherein the first circuit member comprises a package for an IC device or a socket for an IC device.

10. A method of making an array of integral terminals on a circuit assembly comprising the steps of:

depositing at least a liquid first dielectric layer on the first surface of a first circuit member. imaged to include a plurality of first recesses corresponding to the array of integral terminals;

processing selected surfaces of the first recesses to accept electro-less conductive plating deposition;

electro-lessly plating the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer;

electro-plating the electro-less plating to substantially first recesses with a conductive material;

repeating the depositing, processing, electro-less plating, and electro-plating steps to form the integral terminals including at least one undercut;

removing the dielectric layers to expose the integral terminals;

preparing a printed circuit board with a plurality of recesses configured to receive the integral terminals;

positioning a plurality of contact members that are electrically coupled with circuitry on a first major surface of the printed circuit board and extend into the recesses generally parallel to the major surface;

inserting the integral terminals on the first circuit member into the recesses of the printed circuit board; and

shifting the first circuit member relative to the printed circuit board generally parallel to the major surface to electrically couple the contact members with the undercuts on the integral terminals.

11. The method of claim 10 wherein the exposed terminal comprise a non-cylindrical shape.

12. The method of claim 10 wherein the integral terminals comprise a plurality of discrete contact surfaces.

13. The method of claim 10 comprising forming the recesses with exposed portions with cross-sectional shapes greater than cross-sectional shapes of the contact members so insertion of the integral terminals on the first circuit member into the recesses on the PCB is a zero or low insertion force process.

14. The method of claim 10 comprising electrically coupling multiple surfaces on the exposed terminal with the contact members on the PCB.

15. The method of claim 10 wherein the integral terminals comprise a narrow portions, the method comprising mechanically coupling arms on the contact members with the narrow portions on the integral terminals.

16. The method of claim 10 wherein the integral terminals comprise a narrow portions, the method comprising electrically coupling the contact members with the narrow portions on the integral terminals.

17. The method of claim 10 wherein the contact members comprise arms and the method comprises extending the arms around, at least 150 degrees of the integral terminals.

18. The method of claim 10 wherein the contact members comprise arms and the method comprises electrically coupling the arms with at least two locations on the integral terminals.

19. The method of claim 10 comprising the steps of:

filling the recesses in the, printed circuit board with a solder mask;

processing a circuitry layer on the printed circuit board including the contact members; and

removing the solder mask from the recesses to leave the contact members in a cantilevered configuration with respect to the recesses.