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Detecting defects on a wafer

  • US 9,355,208 B2
  • Filed: 07/01/2014
  • Issued: 05/31/2016
  • Est. Priority Date: 07/08/2013
  • Status: Active Grant
First Claim
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1. A method for detecting defects on a wafer, comprising:

  • determining locations of all instances of a weak geometry in a design for a wafer, wherein the locations comprise random, aperiodic locations, and wherein the weak geometry comprises one or more features that are more prone to defects than other features in the design;

    scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system; and

    detecting defects in one instance of the weak geometry based on the output generated at two or more instances of the weak geometry at the random, aperiodic locations in a single die on the wafer, wherein said determining and said detecting are performed with one or more computer systems.

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