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Semiconductor packages utilizing leadframe panels with grooves in connecting bars

  • US 9,355,995 B2
  • Filed: 01/10/2014
  • Issued: 05/31/2016
  • Est. Priority Date: 12/13/2010
  • Status: Active Grant
First Claim
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1. A method comprising:

  • utilizing a leadframe panel comprising a plurality of leadframe modules, each of said plurality of leadframe modules having a leadframe pad;

    said leadframe panel having a plurality of bars each having a plurality of grooves, said plurality of bars connecting said plurality of leadframe modules;

    attaching a device to said leadframe pad;

    molding said leadframe panel while leaving a bottom of said leadframe pad exposed;

    sawing through said plurality of grooves of said plurality of bars to singulate said plurality of leadframe modules into separate packaged modules, wherein each of said plurality of grooves is entirely discarded from each of said plurality of leadframe modules.

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