Integrated circuit assemblies with reinforcement frames, and methods of manufacture
First Claim
Patent Images
1. An assembly comprising:
- a first substrate comprising a plurality of first contact pads;
a plurality of modules attached to the first substrate, at least one said module comprising a semiconductor integrated circuit, the module comprising one or more contact pads each of which is attached to a respective first contact pad;
a reinforcement frame comprising one or more cavities, the reinforcement frame being attached to the first substrate, wherein at least part of each said module is located in a corresponding cavity in the reinforcement frame, wherein at least two said modules have different heights and are at least partially located in the same cavity in the reinforcement frame;
wherein the reinforcement frame comprises a through-hole; and
the assembly further comprises one or more heat sinks each of which overlies the through-hole, wherein at least one said heat sink overlying the through-hole is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than the reinforcement frame.
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Abstract
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames (410) attached to the wiring substrate. The modules are located in openings (e.g. cavities and/or through-holes 414) in the reinforcement frame. Other features are also provided.
149 Citations
22 Claims
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1. An assembly comprising:
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a first substrate comprising a plurality of first contact pads; a plurality of modules attached to the first substrate, at least one said module comprising a semiconductor integrated circuit, the module comprising one or more contact pads each of which is attached to a respective first contact pad; a reinforcement frame comprising one or more cavities, the reinforcement frame being attached to the first substrate, wherein at least part of each said module is located in a corresponding cavity in the reinforcement frame, wherein at least two said modules have different heights and are at least partially located in the same cavity in the reinforcement frame; wherein the reinforcement frame comprises a through-hole; and the assembly further comprises one or more heat sinks each of which overlies the through-hole, wherein at least one said heat sink overlying the through-hole is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than the reinforcement frame.
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2. An assembly comprising:
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a first substrate comprising a first side and one or more first contact pads at the first side; one or more modules attached to the first substrate, each said module comprising a semiconductor integrated circuit, each said module comprising one or more contact pads each of which is attached to a respective first contact pad; and one or more reinforcement frames attached to the first substrate, each said reinforcement frame comprising one or more openings, at least part of each said module being located in a corresponding opening in a corresponding reinforcement frame; wherein in at least one said reinforcement frame, at least one said opening comprises a through-hole; and the assembly further comprises one or more heat sinks each of which overlies one or more of said through-holes in one or more of said reinforcement frames, wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than each said reinforcement frame. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for manufacturing an assembly, the method comprising:
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obtaining a first substrate comprising a first side and one or more first contact pads at the first side; obtaining one or more modules attached to the first substrate, each said module comprising a semiconductor integrated circuit, each said module comprising one or more contact pads each of which is attached to a respective first contact pad; and attaching one or more reinforcement frames to the first substrate, each said reinforcement frame comprising one or more openings, at least part of each said module being located in a corresponding opening in a corresponding reinforcement; wherein in at least one said reinforcement frame, at least one said opening comprises a through-hole; and the method further comprises attaching one or more heat sinks over one or more of said through-holes in one or more of said reinforcement frames, wherein at least one said heat sink overlying at least one said through-hole in at least one said reinforcement frame is attached to the reinforcement frame and/or to at least one said module at least partially located in the through-hole, each said heat sink having a higher thermal conductivity than each said reinforcement frame. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification