Backside structure for BSI image sensor

• US 9,356,058 B2
• Filed: 08/28/2012
• Issued: 05/31/2016
• Est. Priority Date: 05/10/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chuang, Chun-Chieh, Yaung, Dun-Nian, Liu, Jen-Cheng, Wang, Wen-De, Chou, Keng-Yu, Tsai, Shuang-Ji, Kao, Min-Feng
• Primary Examiner(s): YEUNG LOPEZ, FEIFEI
• Application Number:
  US13/597,007
• Publication Number:
  US 20130299931A1
• Time in Patent Office: 1,372 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements

Abstract

An embodiment method for forming an image sensor includes forming an anti-reflective coating over a surface of a semiconductor supporting a photodiode, forming an etching stop layer over the anti-reflective coating, forming a buffer oxide over the etching stop layer, and selectively removing a portion of the buffer oxide through etching, the etching stop layer protecting the anti-reflective coating during the etching. An embodiment image sensor includes a semiconductor disposed in an array region and in a periphery region, the semiconductor supporting a photodiode in the array region, an anti-reflective coating disposed over a surface of the semiconductor, an etching stop layer disposed over the anti-reflective coating, a thickness of the etching stop layer over the photodiode in the array region less than a thickness of the etching stop layer in the periphery region, and a buffer oxide disposed over the etching stop layer in the periphery region.

Claims

1. A method for forming an image sensor, comprising:

forming an anti-reflective coating over and in direct contact with a first semiconductor surface of a semiconductor, the semiconductor supporting a photodiode adjacent to a second surface of the semiconductor opposite the first surface of the semiconductor, wherein the anti-reflective coating is a single material with a constant thickness throughout the anti-reflective coating;

forming an etching stop layer in direct physical contact with the single material;

forming a buffer oxide over the etching stop layer; and

selectively removing a portion of the buffer oxide through etching, the etching stop layer protecting the anti-reflective coating during the etching.

2. The method of claim 1, wherein a refractive index value of the etching stop layer is equivalent to a refractive index value of the anti-reflective coating.

3. The method of claim 1, wherein a passivation film is formed over the etching stop layer after the etching.

4. The method of claim 3, wherein a refractive index value of the etching stop layer is equivalent to a refractive index value of the passivation film.

5. The method of claim 3, wherein a refractive index value of the etching stop layer is between a refractive index value of the anti-reflective coating and a refractive index value of the passivation film.

6. The method of claim 1, wherein an etching selectivity of the etching stop layer is greater than an etching selectivity of the buffer oxide.

7. The method of claim 1, wherein the selectively removing includes removing the portion of the buffer oxide over the photodiode.

8. The method of claim 1, wherein the selectively removing includes removing the buffer oxide from a sensor array region of the image sensor without removing the buffer oxide from a periphery region of the image sensor.

9. The method of claim 1, further comprising forming a metal shield over the buffer oxide and selectively removing a portion of the metal shield over the photodiode during the etching process.

10. The method of claim 1, wherein the etching stop layer is selected from a group consisting essentially of silicon nitride (SiN), silicon carbide (SiC), and silicon oxynitride (SiON), and combinations thereof.

11. A method for forming an image sensor, comprising:

forming an anti-reflective coating over and in direct contact with a surface of a semiconductor, wherein the anti-reflective coating is dielectric material throughout the anti-reflective coating and the semiconductor supporting a photodiode for a back-side image sensor;

forming an etching stop layer over and in direct contact with the anti-reflective coating;

forming a buffer oxide over and in direct contact with the etching stop layer;

forming a metal shield over and in direct contact with the buffer oxide;

disposing a mask over and in direct contact with a portion of the metal shield to define a periphery region and an array region, the array region including the photodiode; and

removing the metal shield and the buffer oxide in the array region through etching, the etching stop layer protecting the anti-reflective coating in the array region during the etching.

12. The method of claim 11, further comprising forming a passivation film over the metal shield in the periphery region and over the etching stop layer in the array region, wherein the passivation film comprises a first material and the etching stop layer comprises the first material.

13. The method of claim 12, wherein a refractive index value of the etching stop layer is within a range defined by the refractive index value of the anti-reflective coating and the refractive index value of the passivation film, inclusive.

14. The method of claim 11, wherein an etching selectivity between the buffer oxide and the etching stop layer is in a range of about 3 to about 10.

15. The method of claim 11, wherein a portion of the etching stop layer in the array region is removed during the etching process.

16. The method of claim 11, wherein the etching process is performed without removing the buffer oxide and the metal shield from the periphery region.

17. A method for forming an image sensor, comprising:

providing a substrate, the substrate having an array area and a periphery area, the substrate having a photosensitive element along a first surface of the substrate in the array area;

forming an anti-reflective coating in direct physical contact with a second surface of the substrate, wherein the anti-reflective coating comprises a single material throughout the anti-reflective coating and the second surface is a surface of semiconductor material;

forming an etching stop layer in direct physical contact with the anti-reflective coating;

forming a buffer oxide layer over the etching stop layer, wherein the buffer oxide layer has a high etch selectivity relative to the etching stop layer;

forming a metal shield over the buffer oxide layer;

forming a patterned mask over the metal shield, the patterned mask exposing at least a portion of the array area; and

removing the metal shield from the array area.

18. The method of claim 17, further comprising forming a buffer oxide after the forming the etching stop layer and before the forming the metal shield, wherein the forming the metal shield comprises forming the metal shield on the buffer oxide.

19. The method of claim 17, wherein the removing the metal shield removes a portion of the etching stop layer.

20. The method of claim 17, further comprising removing at least a portion of the metal shield from the periphery area.